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Multi-molding method for fan-out stacked semiconductor package structure

A packaging structure, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid device manufacturing, semiconductor/solid device components, etc., can solve the problem of high cost of molded rubber

Pending Publication Date: 2021-09-07
POWERTECH TECHNOLOGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the cost of molding adhesive is more expensive than the resin used for molding, and currently there is no molding adhesive in the industry that can support the 500mm (width) carrier board used in the fan-out panel level packaging process; therefore, if the fan-out panel level The packaging process to form the second encapsulant of the stacked semiconductor packaging structure will be a technical bottleneck that needs to be further improved and overcome.

Method used

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  • Multi-molding method for fan-out stacked semiconductor package structure
  • Multi-molding method for fan-out stacked semiconductor package structure
  • Multi-molding method for fan-out stacked semiconductor package structure

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Embodiment Construction

[0052] Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

[0053] The present invention proposes an improvement on the molding step of the fan-out panel level packaging process. The technology of the present invention will be described in detail below with reference to the accompanying drawings.

[0054] refer to Figure 1A to Figure 1H Shown is the multi-layer molding method of the fan-out stacked semiconductor package structure 1 of the present invention, which includes the following steps (a) to (h).

[0055] In step (a), if Figure 1A As shown, a carrier 10 for fan-out semiconductor packaging process is provided; in this embodiment, the carrier 10 is used for fan-out panel level packaging, and its width is greater than or equal to 500mm.

[0056] In step (b), if Figure 1A As shown, a plurality of first packaging structures 20 are formed on the carrier 10; in this embodiment, t...

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Abstract

A multi-molding method for a fan-out stacked semiconductor package structure is disclosed. Two molding chambers with different sizes are provided. Multiple first packages made in front-end packaging process are placed in a first molding chamber with smaller size to form a first molding compound. After then, multiple second packages made in back-end are placed in a second molding chamber with larger size to form a second molding compound. The second molding compound encapsulates the first molding compound. Therefore, the multi-molding method of the present invention is adapted to be used in fan-out panel level package process without an expensive compression mold tape.

Description

technical field [0001] The invention relates to a molding method of a fan-out stacked semiconductor packaging structure, in particular to a multi-layer molding method of a fan-out stacked semiconductor packaging structure. Background technique [0002] see figure 2 As shown, it is a stacked semiconductor package structure 80, which is packaged by wafer-level packaging process, and mainly includes a first redistribution layer 81, a lower chip 82, two upper chips 83 and a second redistribution layer 84; wherein the lower chip 82 is first adhered to the second redistribution layer 84, and a first sealing body 85 is formed by molding, and the first sealing body 85 covers the lower chip 82; then on the sealing body 85 The first redistribution layer 81 is formed on the top, and then the two upper chips 83 are bonded to the first redistribution layer 81 by means of flip-chip bonding, and then a stamper is used to paste and cover the two upper chips 83, A second encapsulant 90 is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/60
CPCH01L21/568H01L21/565H01L24/03H01L2224/0231H01L21/56H01L21/6835H01L2221/68345H01L25/0655H01L23/5389H01L23/49816H01L23/5384H01L2224/96H01L2224/73204H01L2224/16227H01L2224/32225H01L2224/19H01L2224/20H01L2224/95H01L24/19H01L24/81H01L24/96H01L2224/81H01L2224/16225H01L2924/00H01L23/3128H01L23/5383H01L23/5386H01L24/20H01L2224/214H01L21/4853H01L21/4857H01L21/78H01L2221/68372
Inventor 刘圣捷
Owner POWERTECH TECHNOLOGY INC