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Preparation method of bismuth-based silica material and its application in trapping radioactive iodine

A silicon dioxide and bismuth-based technology, applied in radioactive purification, chemical instruments and methods, silicon compounds, etc., can solve the problems of complex operation, high cost, and poor iodine adsorption capacity, and achieve simple operation, low cost, and high-efficiency synthesis Effect

Active Publication Date: 2022-01-28
SOUTHWEAT UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The present invention aims at the problems of complex operation, high cost, poor iodine adsorption capacity and the like in the existing synthesis method, using bismuth nitrate as the bismuth source, stannous chloride as the reducing agent, and commercial nano-silicon dioxide as the carrier, and adopts a simple and efficient impregnation method to synthesize Bismuth-based silica (Bi-SiO 2 ) iodine capture material, and evaluate its adsorption performance for iodine

Method used

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  • Preparation method of bismuth-based silica material and its application in trapping radioactive iodine
  • Preparation method of bismuth-based silica material and its application in trapping radioactive iodine
  • Preparation method of bismuth-based silica material and its application in trapping radioactive iodine

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Embodiment 1~3

[0027] A preparation method of bismuth-based silicon dioxide material, comprising the following steps:

[0028] Step 1, bismuth nitrate is dissolved in 100mL nitric acid solution (1M) to obtain bismuth nitrate solution;

[0029] Step 2, adding nano-SiO to the bismuth nitrate solution 2 , stirred for 30min to obtain solution I;

[0030] Step 3, dissolving tin protochloride in sodium hydroxide solution to obtain solution II;

[0031] Step 4: Mix solution I and solution II, stir for 5 minutes, wash and filter to obtain a solid;

[0032] Step five, the solid obtained in step four is sintered at 400° C. for 6 h under an argon-hydrogen reducing protective atmosphere to obtain a bismuth-based silicon dioxide material (Bi-SiO 2 );Such as figure 1 As shown, comparing the XRD patterns before and after doping with Bi, it can be seen that the characteristic diffraction peak intensity of Bi increases with the increase of Bi content. This result shows adopting the method of the present...

Embodiment 4

[0034] A preparation method of bismuth-based silicon dioxide material, comprising the following steps:

[0035] Step 1, bismuth nitrate is dissolved in 100mL nitric acid solution (1M) to obtain bismuth nitrate solution;

[0036] Step 2, adding nano-SiO to the bismuth nitrate solution 2 , stirred for 30min to obtain solution I;

[0037] Step 3, dissolving tin protochloride in sodium hydroxide solution to obtain solution II;

[0038] Step 4. Mix solution I and solution II, stir for 5 minutes, and while stirring, use an infrared lamp to intermittently irradiate the mixed reaction solution of solution I and solution II, wash and filter to obtain a solid; the infrared lamp The power is 275W; the distance between the infrared lamp and the mixed reaction solution is 5cm; the intermittent irradiation is irradiated for 1min, and the irradiation is stopped for 30s, so as to circulate;

[0039] Step five, the solid obtained in step four is sintered at 400° C. for 6 hours under an argo...

Embodiment 5

[0041] A preparation method of bismuth-based silicon dioxide material, comprising the following steps:

[0042] Step 1, bismuth nitrate is dissolved in 100mL nitric acid solution (1M) to obtain bismuth nitrate solution;

[0043] Step 2, adding nano-SiO to the bismuth nitrate solution 2 , stirred for 30min to obtain solution I;

[0044] Step 3, dissolving tin protochloride in sodium hydroxide solution to obtain solution II;

[0045] Step 4: Mix solution I and solution II, stir for 5 minutes, wash and filter to obtain a solid;

[0046] Step 5. Sinter the solid obtained in step 4 at 400°C for 6 hours under an argon-hydrogen reducing protective atmosphere to obtain a bismuth-based silica material; reprocess the bismuth-based silica material. The process is: bismuth-based silica The silicon material is placed in a low-temperature plasma processor, and gas is introduced into the low-temperature plasma processor to form a plasma and treat the bismuth-based silicon dioxide material...

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Abstract

The invention discloses a preparation method of a bismuth-based silicon dioxide material and its application in capturing radioactive iodine, comprising: dissolving bismuth nitrate in a nitric acid solution to obtain a bismuth nitrate solution; adding nanometer SiO to the bismuth nitrate solution 2 , stirred for 30-45min to obtain solution I; dissolving stannous chloride in sodium hydroxide solution to obtain solution II; mixing solution I with solution II, stirring for 5-10min, washing and filtering to obtain a solid; The obtained solid is sintered at 350-450° C. for 5.5-6.5 hours under an argon-hydrogen reducing protective atmosphere to obtain a bismuth-based silicon dioxide material. The present invention adopts a simple impregnation reduction method, uses bismuth nitrate as a bismuth source, and tin protochloride as a reducing agent, and can synthesize bismuth-based silica materials in a relatively short period of time, simply and efficiently, and the iodine content of the bismuth-based silica materials High adsorption capacity, much higher than other similar materials.

Description

technical field [0001] The invention relates to the field of material technology and radioactive waste treatment, in particular to a preparation method of a bismuth-based silicon dioxide material and its application in capturing radioactive iodine. Background technique [0002] With the rapid development of my country's nuclear energy industry, the safe disposal of radioactive waste has become the focus of people's increasing attention, especially the leakage of the Fukushima nuclear power plant in Japan, resulting in a large amount of radioactive gaseous iodine and inorganic iodine in the environment of surrounding areas, radioactive iodine ( 129 I) is one of the main sources of radioactive waste hazards because of its long half-life (1.57×10 7 years) pose a serious threat to humans, and its removal by adsorption is considered to be one of the good strategies. Therefore, the removal of radioactive gaseous iodine from the environment is very necessary. At present, the adso...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J20/10B01J20/30G21F9/02
CPCB01J20/103B01J20/02G21F9/02B01J2220/4806B01J2220/42
Inventor 丁艺段涛旦辉鲜强陈李
Owner SOUTHWEAT UNIV OF SCI & TECH