Processing Apparatus
A technology for processing devices and processed objects, applied in metal processing equipment, automatic grinding control devices, manufacturing tools, etc.
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[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 The shown processing apparatus 1 has a rough grinding unit 30 and a finish grinding unit 31 by which a wafer 100 held on any one of the chuck tables 5 is ground.
[0019] figure 1 The illustrated wafer 100 is an example of a workpiece, and is, for example, a circular semiconductor wafer. Devices not shown are formed on the front surface 101 of the wafer 100 . The front side 101 of the wafer 100 is in figure 1 The center faces downward and is protected by affixing a protective tape 105 . The back surface 104 of the wafer 100 is a surface to be processed to be subjected to grinding.
[0020] The processing device 1 has a first device base 10 and a second device base 11 disposed behind (+Y direction side) the first device base 10 . On the first device base 10 is a loading / unloading area 401 , which is an area where wafers W are loaded / unloaded. A pro...
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