Substrate taking and placing device and taking and placing method

Abstract

The invention provides a substrate taking and placing device and a taking and placing method. The substrate taking and placing device comprises at least one mechanical arm, a plurality of substrate forks are arranged on the mechanical arm, and each substrate fork is provided with a plurality of vacuum suction cups and a CDA pipeline connected with the vacuum suction cups; and each mechanical arm is further provided with a plurality of pressure electronic meter heads and a plurality of electromagnetic valves, any pressure electronic meter head correspondingly measures the vacuum degree of the vacuum suction cups on any substrate fork, and any electromagnetic valve correspondingly controls connection and disconnection of the CDA pipeline on any substrate fork. The plurality of electromagnetic valves are arranged, any electromagnetic valve correspondingly controls the connection and disconnection of the CDA pipeline on any substrate fork, when the number of the vacuum suction cups with the vacuum degree reaching the preset range meets the requirement, the CDA pipelines corresponding to the vacuum suction cups with the vacuum degree not reaching the preset range can be disconnected through the electromagnetic valves, thus machine alarm downtime is avoided, abnormal vacuum suction of the mechanical arms can be effectively improved, and the stability of the substrate taking and placing device is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate pick-and-place device and a pick-and-place method. Background technique [0002] In the production process of display panels, it is usually necessary to use magnetron sputtering equipment for coating process. In the coating process, it is usually necessary to use a robotic arm to absorb the glass substrate, and then flip the glass substrate from a horizontal state to a vertical state, or from a vertical state to a horizontal state. During the adsorption process, because the area of ​​the glass substrate is too large (2940mm*3370mm), abnormal vacuuming will inevitably occur (referring to the poor contact between the suction cup and the glass substrate in the vacuum state, resulting in insufficient vacuum, vacuum The speed is not up to the alarm). [0003] The existing mechanical arm is equipped with 7 substrate forks, each substrate fork is equipped with 11 suction ...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a substrate pick-and-place device, which is used to solve the technical problems of abnormal vacuum suction in the substrate pick-and-place device in the prior art, which leads to machine downtime and low production efficiency.

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