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Method for producing a cooling body for an electronic component

A technology of electronic components and cooling bodies, which is applied in the direction of modification of power electronics, electrical components, and structural parts of electrical equipment, and can solve problems such as work and cost

Pending Publication Date: 2021-09-28
VOLKSWAGEN AG
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this approach proved to be labor and cost-intensive overall

Method used

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  • Method for producing a cooling body for an electronic component
  • Method for producing a cooling body for an electronic component
  • Method for producing a cooling body for an electronic component

Examples

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Embodiment Construction

[0023] In the drawings the same reference signs denote the same or similar elements.

[0024] figure 1 The starting materials for carrying out the method according to the invention for producing the heat sink 10 are shown in a very schematic illustration. A sheet metal stack 12 consisting of aluminum sheet metal 121 and copper sheet metal 122 is used as raw material. In the embodiment shown, the two sheet metals 121 , 122 have similar material thicknesses, but the aluminum sheet metal 121 projects laterally beyond the copper sheet metal 122 on all sides. The sheets 121 , 122 are not brazed or welded to each other due to the incompatibility of aluminum and copper. Rather, mechanical stabilization is sufficient for their relative position. The mechanical stability can be improved by point-by-point bonding.

[0025] exist figure 1 The raw material shown in is subjected to the cold stamping method according to the invention and formed into a cooling body 10, wherein in figu...

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Abstract

The invention relates to a method for producing a cooling body (10) for an electronic component, comprising the steps of: providing a first sheet metal section (122) having a thickness of 1 to 5 mm, said first sheet metal section being made of copper or an alloy containing mainly copper; providing a second sheet metal section (121) of at least the same thickness, said second sheet metal section consisting of aluminum or an alloy containing mainly aluminum; stacking the two sheet metal sections (121, 122) concentrically on top of each other to form a sheet metal stack (12); and shaping the sheet metal stack (12) by means of a cold stamping method into a cooling body (10) having a flat upper side (18) and a profile-containing lower side forming the cooling structure (14), wherein the upper side (18) is made of the material of the first sheet metal section (122) with an edge (181) made of the material of the second sheet metal section (121), and the lower side is entirely made of the material of the second sheet metal section (121).

Description

technical field [0001] The invention relates to a method for producing a heat sink for electronic components. Background technique [0002] Semiconductor components must usually be protected from overheating by efficient cooling systems. This also applies in particular to so-called power modules (IGBTs), as they are used for controlling electric machines in the field of electric drives and hybrid drives in the motor vehicle sector. Such a power module (the specific design of which is not important within the scope of the present invention) usually has a layer of a solderable or sinterable material, such as copper, on its underside, which can be controlled via the The layer material is connected to the cooling body in a cooperative manner. The heat sink has generally pin-shaped, plate-shaped or labyrinth-shaped cooling structures which, in the final assembled state, sink into coolant channels through which the coolant flows. Here, a "Pin Fin" construction or a "Power Showe...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2089H05K7/209
Inventor J·U·穆勒O·郎M·普列斯E·肖霍夫
Owner VOLKSWAGEN AG
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