Marking line processing mould and process of steel reinforcing sheet for 5G chip circuit board
A processing technology and reinforcing sheet technology, applied in the field of precision marking line processing, can solve the problems of small punch size and easy die breakage.
Active Publication Date: 2021-10-08
深圳市腾鑫精密电子芯材科技有限公司
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Problems solved by technology
However, due to the small size of the punch used in the precision marking line processing technology, this type of mold is easily damaged by the traditional stamping process. Therefore, a new mold and related processes are urgently needed to ensure Precision Marking Line Processing Efficiency
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[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the application; the terms used herein in the description of the application are only to describe specific embodiments The purpose is not to limit the present application; the terms "comprising" and "having" and any variations thereof in the specification and claims of the present application and the description of the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second" and the like in the description and claims of the present application or the above drawings are used to distinguish different objects, rather than to describe a specific order.
[0034] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrenc...
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Abstract
The embodiment of the invention belongs to the technical field of precise marking line processing, and relates to a marking line processing mould of a steel reinforcing sheet for a 5G chip circuit board. The marking line processing mould of the steel reinforcing sheet for the 5G chip circuit board comprises a first mould body and a second mould body, wherein the first mould comprises a first body, the first body is a first punch with a stamping surface, and the stamping surface is a smooth plane with a first pressing rib; the first pressing rib forms a pattern of a required marking line on the stamping surface, and the section of the first pressing rib is rectangular; the second mould body comprises a second body, the second body is a second punch with a stamping surface, and the stamping surface is a smooth plane provided with a second pressing rib; the second pressing rib forms a pattern of a required marking line on the stamping surface, and the section of the second pressing rib is trapezoidal; the second pressing rib is higher than the first pressing rib. According to the marking line processing mould of the steel reinforcing sheet for the 5G chip circuit board, the two mould bodies are designed, one mould body is provided with the first pressing rib with the rectangular section, the other mould body is provided with the second pressing rib with the trapezoidal section, and the problem that only a laser engraving or etching process can be used during precise engraving line processing is solved.
Description
technical field [0001] The present application relates to the technical field of precision marking line processing, and in particular to a marking line processing mold and process for a steel reinforcement sheet for a 5G chip circuit board. Background technique [0002] On the steel reinforcement sheet for 5G chip circuit board, the marking line processing is mainly realized by laser marking process and etching process. In addition, the similar precision marking line processing technology also has stamping technology. Compared with the stamping process, laser marking process and etching process, the forming efficiency of the laser marking process and the etching process is lower, and the forming efficiency of the stamping process is the highest. However, due to the small size of the punch used in the precision marking line processing technology, this type of mold is easily damaged by the traditional stamping process. Therefore, a new mold and related processes are urgently ...
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IPC IPC(8): B21D37/10B21D13/02B21D35/00
CPCB21D37/10B21D13/02B21D35/002
Inventor 陈成蔡振猛蒋松柏
Owner 深圳市腾鑫精密电子芯材科技有限公司