Automatic die bonder for semiconductor chip processing

A technology of semiconductor and die bonding machine, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of cumbersome operation and uneven dispensing, and achieve the effect of ensuring quality, easy operation and improving processing efficiency

Pending Publication Date: 2021-10-29
深圳市森孚科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of cumbersome operation and uneven glue dispensing in the prior art, and propose an automatic die bonding machine for semiconductor chip processing

Method used

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  • Automatic die bonder for semiconductor chip processing
  • Automatic die bonder for semiconductor chip processing
  • Automatic die bonder for semiconductor chip processing

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Embodiment Construction

[0028] refer to Figure 1-8 , an automatic die bonding machine for semiconductor chip processing, including a base 1, the upper surface of the base 1 is fixedly connected with a slide rail 2, and the slide rail 2 is slidably connected with a sliding seat 3, such as figure 1 As shown, the cross-section of the sliding seat 3 is I-shaped, and the upper surface of the sliding seat 3 is provided with a chip tray, a processing tray, and a tin plastic tray, and its setting direction is as follows: figure 1 Arranged from right to left, the upper surface of base 1 is fixedly connected with U-shaped beam 4, the lower surface of U-shaped beam 4 is fixedly connected with electric push rod 7, the lower surface of the horizontal part of electric push rod 7 is fixedly connected with electric push rod 7, and the electric push rod 7 The output end of the rod 7 is fixedly connected with a vacuum block 701. A vacuum cavity is arranged in the vacuum block 701, and a vacuum suction head is provide...

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Abstract

The invention discloses an automatic die bonder for semiconductor chip processing; the die bonder disclosed by the present invention comprises a base, the upper surface of the base is fixedly connected with a sliding rail, the sliding rail is slidably connected with a sliding seat, the upper surface of the base is fixedly connected with a U-shaped beam, and the lower surface of the U-shaped beam is fixedly connected with an electric push rod. The output end of the electric push rod is fixedly connected with a vacuum block, two mounting cavities are formed in the U-shaped beam, a rectangular hole is formed in the side wall of the U-shaped beam, the U-shaped beam is connected with two sliding plates in a penetrating and sliding mode through the rectangular hole, and the two sliding plates are jointly and fixedly connected with the vacuum block; an adjusting groove is formed in the section, located in the mounting cavity, of each sliding plate. The automatic die bonder has the advantages that compared with the prior art, all the discs on the sliding seat can be automatically replaced, manual replacement is not needed, use is more convenient, the machining efficiency is greatly improved, meanwhile, tin glue can be distributed more evenly, and the product quality is guaranteed.

Description

technical field [0001] The invention relates to the technical field of chip processing equipment, in particular to an automatic chip bonding machine for semiconductor chip processing. Background technique [0002] With the continuous development of science and technology, the development of electronic equipment is also advancing by leaps and bounds. One of the important components in electronic equipment is the chip. The existing chip bonder often needs to set up two operation heads to carry out the operation of sucking the film and bonding the film respectively, and it is easy to have accumulated errors after multiple operations. [0003] Existing invention patents, such as a Chinese patent application No. 201711249918.X, discloses an automatic chip bonder, which is mainly composed of a controller, a bottom plate, a frame, and a vacuum suction head. The functions of the film head are concentrated on one vacuum suction head, which simplifies the equipment and facilitates th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67121H01L21/68735
Inventor 黄雪仪
Owner 深圳市森孚科技有限公司
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