A device and method for high-precision detection of leaked drilling holes on a circuit board

Abstract

The invention discloses a high-precision device and method for detecting leaked drilling holes on a circuit board, which comprises a workbench (1), a gantry frame (2) fixed on the workbench (1), and a fixing seat (4). A sinking groove (5) is opened on the top surface of the bottom plate (11), and the detection mechanism (13) includes a step hole (14) opened on the top surface of the bottom plate (11), a slider (15) slidingly installed in the large hole of the step hole (14) ), the bottom of the small hole of the step hole (14) is provided with a guide hole (17) penetrating through the bottom surface of the bottom plate (11), and the top and bottom surfaces of the slider (15) are respectively fixed with upper pressure rods (18) and The lower pressing rod (19), the upper pressing rod (18) extend in the gap (12), and the lower pressing rod (19) is slidably installed in the guide hole (17) and extends below the bottom plate (11). The beneficial effect of the invention is that all missing drillings can be detected at one time, the detection is thorough, the detection efficiency of missing drillings is high, and the production efficiency of circuit boards is improved.

Description

technical field [0001] The invention relates to the technical field of precision drilling on a circuit board, in particular to a high-precision device and method for detecting missing drilling on a circuit board. Background technique [0002] With the continuous development of 5G technology, the number of 5G communication equipment is also increasing, and the number of circuit boards used in 5G communication equipment is also increasing. The structure of a standard circuit board is as follows: Figure 1~2 As shown, it includes a substrate and a circuit layer respectively arranged on the upper and lower surfaces of the substrate. There are multiple rows of through holes 33 arranged in the substrate. The upper and lower ends of the through holes 33 respectively penetrate the upper circuit layer and the lower circuit layer. There are the following: 1. Relieve the current pressure. 2. When the product is in operation, the circuit board will be very hot. Properly increasing the t...

AI Technical Summary

Problems solved by technology

After the circuit board is mass-produced and formed, the process requires that the number of through holes 33 meet the requirements. In the later quality inspection process, the quality inspector often finds that there are missing drills on the circuit board, that is, through holes at local positions on the circuit board. 33 has not been processed. This kind of circuit board is unqualified and can only be reworked. The reason for this problem is that the number of through holes processed is large, and it is easy to manually operate or judge problems, resulting in some through holes not being processed. processed out

[0003] Yet still there are following problems by manual quality inspection: 1, the quantity of through hole 33 on the circuit board is many, and distribution is irregular, and quality inspector can't find all leak drilling holes, causes some unqualified circuit boards to flow out to the market , resulting in customer complaints, and the problem of incomplete detection of through holes

II. It takes a long time for workers to detect the through holes 33 on a circuit board, resulting in only 30 to 40 circuit boards can be detected a day, thereby greatly reducing the factory output of circuit boards, which in turn affects the economic efficiency of the enterprise. There is a defect of low detection efficiency

III. Even if it is detected that there is a leaky drilling hole, return the unqualified circuit board to the superior drilling station, and fix the unqualified circuit board tooling again. After the tooling is fixed, use the drill bit to check the undrilled position Drilling, although it can produce standard circuit boards, but it takes a lot of time for intermediate turnover and tooling to fix circuit boards, which reduces the factory output of circuit boards and has technical defects of low production efficiency

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