Silicon wafer bearing device and separation equipment
A technology for carrying devices and silicon wafers, which is applied to chemical instruments and methods, cleaning methods and utensils, cleaning flexible objects, etc., can solve the problems of leaking silicon wafers, inconsistent loading heights of silicon wafers, etc., and achieve the effect of avoiding leaking clips.
Active Publication Date: 2021-11-05
XIAN ESWIN SILICON WAFER TECH CO LTD
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Problems solved by technology
[0006] In order to solve the above technical problems, the present invention provides a silicon wafer carrying device and separation equipment to solve the problem of missing silicon wafers due to inconsistent silicon wafer loading heights
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[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.
[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying...
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The invention relates to a silicon wafer bearing device. The device comprises a base station, wherein the base station comprises a plurality of clamping grooves arranged in an array, and a plurality of clamping grooves located in the same row jointly bear silicon wafers; each clamping groove comprises a plurality of sub-clamping grooves which are overlapped in the direction perpendicular to the base station, and the widths of the sub-clamping grooves in the first direction are reduced along with the increase of the depth of the clamping groove; the device further comprises a telescopic structure, and the telescopic structure is used for controlling silicon wafers borne in at least one sub-clamping groove to move in the direction perpendicular to the base station so that distances between the silicon wafers borne in the different sub-clamping grooves and the base station are the same. The invention also relates to a separation device. Through the arrangement of the telescopic structure, the positions of the borne silicon wafers are adjusted, so the silicon wafers borne on the base station are equal in height, and missing clamping when a mechanical arm clamps the silicon wafers is avoided.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a silicon wafer carrying device and separation equipment. Background technique [0002] In the silicon wafer processing technology, the silicon wafer cleaning process determines the cleanliness of the silicon wafer surface, which will directly affect the residual amount of particles and pollutants on the silicon wafer surface. Therefore, the cleaning process of silicon wafers has become an extremely important part in the production of silicon wafers. [0003] In the current cleaning process, most of them use the tank cleaning method, which is to put all the silicon wafers in the entire cassette (chip box) into the cleaning tank for cleaning. Firstly, the silicon wafers in the box are ejected upwards by the separation pallet, and separated from the box, and then there will be a mechanical arm above the silicon wafers to pick up the whole box of silicon wafers at one time, ...
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IPC IPC(8): H01L21/673H01L21/687B08B11/02
CPCH01L21/67326H01L21/68742B08B11/02
Inventor 严涛
Owner XIAN ESWIN SILICON WAFER TECH CO LTD