Wafer Carriers and Separation Equipment
A technology for carrying devices and silicon wafers, applied in cleaning methods and appliances, chemical instruments and methods, cleaning flexible objects, etc., can solve the problems of missing clamping silicon wafers and inconsistent carrying heights of silicon wafers, and achieve the effect of avoiding missing clamping
Active Publication Date: 2021-12-07
XIAN ESWIN SILICON WAFER TECH CO LTD
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Problems solved by technology
[0006] In order to solve the above technical problems, the present invention provides a silicon wafer carrying device and separation equipment to solve the problem of missing silicon wafers due to inconsistent silicon wafer loading heights
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[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.
[0029] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying...
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The invention relates to a silicon chip carrying device, which includes a base platform, and the base platform includes a plurality of slots arranged in an array, and the plurality of slots in the same row jointly carry a silicon chip; each of the slots includes a A plurality of sub-card slots stacked in a direction perpendicular to the abutment, the width of the plurality of sub-card slots in the first direction decreases as the depth of the card slot increases; a telescopic structure is also included , the telescopic structure is used to control the movement of silicon wafers carried in at least one of the sub-card slots along a direction perpendicular to the base, so that the silicon wafers carried in different sub-card slots and the base The distance between the tables is the same. The invention also relates to a separation device. Through the arrangement of the telescopic structure, the position of the silicon chip carried is adjusted, so that the silicon chip carried on the base platform is of the same height, so as to avoid missing clamping when the mechanical arm clamps the silicon chip.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a silicon wafer carrying device and separation equipment. Background technique [0002] In the silicon wafer processing technology, the silicon wafer cleaning process determines the cleanliness of the silicon wafer surface, which will directly affect the residual amount of particles and pollutants on the silicon wafer surface. Therefore, the cleaning process of silicon wafers has become an extremely important part in the production of silicon wafers. [0003] In the current cleaning process, most of them use the tank cleaning method, which is to put all the silicon wafers in the entire cassette (chip box) into the cleaning tank for cleaning. Firstly, the silicon wafers in the box are ejected upwards by the separation pallet, and separated from the box, and then there will be a mechanical arm above the silicon wafers to pick up the whole box of silicon wafers at one time, ...
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IPC IPC(8): H01L21/673H01L21/687B08B11/02
Inventor 严涛
Owner XIAN ESWIN SILICON WAFER TECH CO LTD