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Composite circuit board and terminal equipment

A composite circuit and sub-circuit board technology, applied in the directions of printed circuits, printed circuit components, electrical components, etc., can solve the problems of application limitations and large circuit board size, and achieve the effect of high integration and high flexibility

Pending Publication Date: 2021-11-09
TCL COMM NINGBO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies in the prior art above, the purpose of the present invention is to provide a composite circuit b

Method used

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  • Composite circuit board and terminal equipment
  • Composite circuit board and terminal equipment
  • Composite circuit board and terminal equipment

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Embodiment Construction

[0020] The present invention provides a composite circuit board and terminal equipment. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the word "comprising" used in the description of the present invention refers to the presence of said features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, Integers, steps, operations, elements, components, and / or groups thereof. It will be understood that when an element is refer...

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Abstract

The invention provides a composite circuit board and terminal equipment. The composite circuit board comprises a mother board located at a bottom layer, a bridging board bonding pad arranged on the mother board, and a sub-circuit board arranged on the bridging board bonding pad. The sub-circuit board is electrically connected with the mother board through the bridging board bonding pad. One or more circuit elements with different functions are placed on the sub-circuit board, and the sub-circuit board can be arranged on the bridging board bonding pad above the mother board, so that the three-dimensional composite circuit board is formed. The composite circuit board provided by the invention has the advantages of high elasticity, high integration degree, small size and good electromagnetic interference suppression effect.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a composite circuit board and terminal equipment. Background technique [0002] The development trend of mobile phone motherboard design is that the size of PCB (circuit board) is becoming smaller and smaller, and the functions are more and more diversified. With the advent of 5G mobile phones, the integration of mobile phones is getting higher and higher. PCB needs to design more functions and distribute more signal lines in a limited size space. There are more and more electronic devices on PCB. The size of PCB The requirements are becoming more and more miniaturized, and the conventional PCB is obviously unable to meet the requirements. [0003] Therefore, prior art still needs to be improved. Contents of the invention [0004] In view of the deficiencies in the prior art above, the object of the present invention is to provide a composite circuit board and terminal...

Claims

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Application Information

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IPC IPC(8): H05K1/11
CPCH05K1/116
Inventor 王佳
Owner TCL COMM NINGBO