Three-dimensional chip and computing system
A three-dimensional chip and chip technology, which is applied in computing, computer, energy-saving computing, etc., can solve the problems of increased memory access power consumption and increased influence of storage walls, so as to share computing burden, reduce power consumption, and improve flexibility Effect
Pending Publication Date: 2021-11-16
XI AN UNIIC SEMICON CO LTD
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[0003] The embodiment of the present application provides a three-dimensional chip and a computing system, which can improve the existing memory access between the host system and the memory as the amount of computation and storage increases, and the impact of the storage wall is increasing. The problem of increased memory power consumption
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[0044] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification will be described in detail below through the drawings and specific examples. The detailed description of the technical solutions of the embodiments is not a limitation to the technical solutions of this specification. In the case of no conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.
[0045] In this document, relational terms such as first and second etc. are used only to distinguish one entity or operation from another without necessarily requiring or implying any such relationship between these entities or operations. Actual relationship or sequence. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to encompass a non-exclusive inclusion such that a process, method, article or appara...
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The invention discloses a three-dimensional chip and a computing system, relates to the technical field of integrated chips, and can improve the existing problems that frequent memory access is performed between an upper system and a memory, the influence of a storage wall is increasingly increased, and the memory access power consumption is increased along with the increase of the computing amount and the storage amount. The three-dimensional chip comprises a storage array chip which comprises a storage array that is used for storing operation data and a target instruction; and a reconfigurable operation chip, which comprises a reconfigurable operation array, wherein the reconfigurable operation array is used for reconstructing an operation function based on the target instruction to obtain a target operation function and executing the target operation function based on the operation data; and the storage array chip and the reconfigurable operation chip are connected in a stacked mode through three-dimensional heterogeneous integration.
Description
technical field [0001] The present application relates to the technical field of integrated chips, in particular to a three-dimensional chip and a computing system. Background technique [0002] In modern large-scale computing systems, the amount of calculation and storage is increasing. However, the existing computing processing systems usually use the upper system to be responsible for calculations, and the memory is responsible for data storage. There is a storage wall between the upper system and the memory. The amount of memory and memory is getting larger and larger, frequent memory access will be performed between the upper system and the memory, the impact of the storage wall is increasing, and the power consumption of memory access is increasing. Contents of the invention [0003] The embodiment of the present application provides a three-dimensional chip and a computing system, which can improve the existing memory access between the host system and the memory as...
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IPC IPC(8): G06F15/78G06F13/16
CPCG06F15/7871G06F13/1668Y02D10/00
Inventor 左丰国江喜平郭一欣周骏
Owner XI AN UNIIC SEMICON CO LTD