Sensor sealing process

Abstract

The invention belongs to the technical field of sensors, and particularly discloses a sensor sealing process, which involves a circuit board, a glue injection hole, a metal cover and an exhaust hole. The sensor sealing process comprises the following operation steps that S1, a sensor is assembled at the upper end of the circuit board, the outer side of a pressure sensing unit is connected with the metal cover in a sleeved mode, and the lower end of the metal cover is connected with the surface of the circuit board; S2, the glue injection hole and the exhaust hole are formed in the upper end of the metal cover, and the glue injection hole is formed in the top of the sensor; S3, a glue injection needle is aligned to the glue injection hole in the top of the sensor, an operator slightly treads a pedal of an automatic glue dispenser to inject a proper amount of glue into the glue injection hole through the glue injection needle, and the glue enters the metal cover through the glue injection hole to fill the internal space of the metal cover, and extrudes air in the metal cover by the glue. The sensor sealing process has the advantages that on the basis of a common process without dispensing any glue, the double-opening iron shell is packaged for protection, then the glue is injected, a bonding pad and the gold wire can be effectively wrapped, only the pressure sensing unit is exposed, and water vapor is comprehensively isolated.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a sensor sealing process. Background technique [0002] A sensor is a detection device that can sense the measured information and convert the sensed information into electrical signals or other required forms of information output according to certain rules to meet the requirements of information transmission, processing, storage, and display. , recording and control requirements, the characteristics of sensors include: miniaturization, digitization, intelligence, multi-function, systematization, networking, it is the first link to realize automatic detection and automatic control, the existence and development of sensors, so that objects With senses such as touch, taste and smell, objects slowly become alive, and are usually divided into thermal sensors, light sensors, gas sensors, force sensors, magnetic sensors, and humidity sensors according to their basic perception functio...

AI Technical Summary

Problems solved by technology

[0003] The existing ordinary dispensing is to drop a drop of glue on the surface of MEMS and ASIC respectively. The surface of MEMS is transparent glue, and the surface of ASIC is black glue, which can block the entry from the pores on the front of the product. A small amount of water vapor falling on the surface of MEMS and ASIC Under the environment of high temperature and high pressure, there is no effective protection for the pads and gold wires on the substrate. When water vapor enters from the air hole and falls on two gold wires or two adjacent pads, it is easy to cause product failure.

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