Cooling fan with semiconductor refrigeration function

A semiconductor and Liangba technology, applied in the field of Liangba, can solve problems such as equipment failure, and achieve the effect of avoiding intrusion and simple structure

Pending Publication Date: 2021-11-30
中电海康无锡科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a semiconductor refrigeration cooler, which solves the problems in the

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cooling fan with semiconductor refrigeration function
  • Cooling fan with semiconductor refrigeration function
  • Cooling fan with semiconductor refrigeration function

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] It should be noted that the features and embodiments in the present invention can be bonded to each other in the case of an unable conflict. The present invention will be described in detail below with reference to the accompanying drawings.

[0031] In order that those skilled in the art better understand the present invention, the present invention in conjunction with the following drawings in the embodiments, the technical solutions in the embodiments of the present invention are clearly and completely described, obviously, the described embodiments are merely a part of the embodiment of the present invention rather than all embodiments. Based on the embodiments in the present invention, those of ordinary skill in the art may belong to the scope of the present invention in the range of the present invention without all other embodiments obtained without making creative labor.

[0032] It should be noted that the specification and claims of the present invention and the t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of cooling fans, and particularly discloses a cooling fan with a semiconductor refrigeration function. The cooling fan with the semiconductor refrigeration function comprises a shell, a cover plate, a fan module, a refrigeration assembly, a partition plate assembly and a control module, wherein a fan air inlet and a first air outlet are formed in the bottom wall of the shell, and a second air outlet is formed in the side wall of the shell; the cover plate covers the shell; the fan module is located in a fan area of an accommodating cavity; the refrigeration assembly is located in a control area of the accommodating cavity; the partition plate assembly is located in the control area of the accommodating cavity; and the control module is located in the control area of the accommodating cavity, is electrically connected with the fan module and the refrigeration assembly, can control the refrigeration assembly to carry out refrigeration treatment on air blown in from the fan air inlet during refrigeration so as to enable the first air outlet to blow out cold air and the second air outlet to blow out hot air, and can control the refrigeration assembly to carry out heating treatment on the air blown in from the fan air inlet during heating so as to enable the first air outlet to blow out hot air and the second air outlet to blow out cold air. By the cooling fan with the semiconductor refrigeration function, a refrigeration function can be fulfilled, and a heating function is also fulfilled.

Description

technical field [0001] The invention relates to the technical field of coolers, in particular to a semiconductor cooler. Background technique [0002] Cooler is also called a ceiling fan, which is installed on the integrated ceiling. Its feature is that it does not occupy a place on the top of the kitchen. In summer, you can enjoy the cool breeze when cooking, and you can adjust the position of the air outlet, so as not to affect the flame of the stove. Features, the bathroom can also be installed, generally installed above the toilet, it will be very cool and comfortable when squatting on the toilet in summer. But the shortcomings of Liangba are also obvious. The wind blown by Liangba is internal circulation, the power is only 40W, and it does not cool. [0003] Today's mainstream coolers on the market only have the function of blowing air, and cannot achieve cooling effects. The coolers with cooling effects also use air-conditioning compressor technology. This solution is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): F24F5/00F24F11/52F24F11/56F24F11/64F24F13/20F24F110/10
CPCF24F5/0042F24F11/64F24F11/52F24F11/56F24F13/20F24F2110/10
Inventor 程学农李学明王伟师建朋
Owner 中电海康无锡科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap