Pixel structure, preparation method thereof and display panel
A technology of pixel structure and scattering structure, which is applied in the direction of instruments, electrical components, electric solid devices, etc., can solve the problem that the color conversion structure of the pixel structure is easy to be damaged, so as to maximize the utilization rate, improve the yield rate, and maximize the luminous efficiency Effect
Pending Publication Date: 2021-11-30
BOE TECH GRP CO LTD
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[0004] In view of the shortcomings of the existing methods, the present application proposes a pixel structure, its preparation method, and a display panel to solve the technical problem in the prior art that the color conversion structure of the pixel structure is easily damaged during the transfer process
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[0119] Optionally, the method for preparing the pixel structure further includes: preparing a second protective layer on the side of the substrate 10 away from the electrode layer 50 , on the side of each micro-luminescent crystal 20 away from the substrate 10 , and on the side of each micro-luminescent crystal 20 80 , and the dimming layer 30 is prepared on the side of the second protective layer 80 away from the substrate 10 and each micro light-emitting crystal grain 20 away from the substrate 10 .
[0120] Optionally, the aforementioned step S130: preparing the light filter layer 40 on the side of the light-adjusting layer 30 away from the substrate includes: preparing the first encapsulation layer 41 on the side of the light-adjustment layer 30 away from the substrate, and the first encapsulation layer 41 A second light-shielding layer is prepared on the side away from the light-adjusting layer 30, and the second light-shielding layer is patterned to obtain a second light-...
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Abstract
The embodiment of the invention provides a pixel structure, a preparation method thereof and a display panel. The pixel structure comprises at least two miniature light-emitting crystal grains arranged at one side of a substrate; a dimming layer which is arranged on one side of the substrate and one side of each miniature light-emitting crystal grain, and comprises comprises a first shading structure and dimming structures corresponding to the miniature light-emitting crystal grains, wherein each dimming structure comprises a first color conversion structure, and each dimming structure further comprises a second color conversion structure and / or a scattering structure; a filter layer which is arranged at the side, away from the substrate, of the dimming layer; and an electrode layer which is arranged at the side, away from the dimming layer, of the substrate and electrically connected with the miniature light-emitting crystal grains. According to the embodiment of the invention, the at least two miniature light-emitting crystal grains and the corresponding color conversion structures are arranged to jointly bear the grabbing and placing force in the transfer and preparation process, so that the first color conversion stress is controlled within a safe range, the damage risk is reduced, and the yield of the pixel structure is further improved.
Description
technical field [0001] The present application relates to the field of display technology, in particular, the present application relates to a pixel structure, a manufacturing method thereof, and a display panel. Background technique [0002] Due to the characteristics of Micro-LED (MicroLight Emitting Diode, micron-scale light-emitting diode) chip size, high integration and self-illumination, it has advantages in brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability. has greater advantages. In the process of manufacturing devices including Micro-LEDs, tens of thousands of pixel structures need to be transferred to the array substrate. [0003] However, during the transfer process, the color conversion structure of the pixel structure is easily damaged. Contents of the invention [0004] In view of the shortcomings of the existing methods, the present application proposes a pixel structure and its preparation method, and...
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IPC IPC(8): H01L27/15H01L33/50H01L33/60H01L33/52H01L33/42G09F9/33
Inventor 李伟董学玄明花张粲王灿袁广才曹占锋张晶晶牛晋飞丛宁杨明坤
Owner BOE TECH GRP CO LTD