Silicon wafer detection device

Abstract

The invention relates to the technical field of silicon wafer detection, and discloses a silicon wafer detection device. The silicon wafer detection device comprises a conveying unit, an acquisition part, an infrared light source and adjusting assemblies. The conveying unit is used for conveying silicon wafers in a conveying direction; the acquisition part and the infrared light source are respectively arranged on two sides, perpendicular to the conveying direction, of the conveying unit, and light rays emitted by the infrared light source can penetrate through the silicon wafers and then reach the acquisition end of the acquisition part; the number of the adjusting assemblies is two, the two adjusting assemblies are connected to the acquisition part and the infrared light source respectively, and the adjusting assemblies can adjust the angle of the acquisition part or the infrared light source. According to the invention, the adjustment range of the relative angle between the acquisition part and the infrared light source is expanded, the imaging effect is ensured, the clear degree of defects such as subfissure on the silicon wafers on acquired images is improved, and the accuracy of a detection result is ensured.

Description

technical field [0001] The invention relates to the technical field of silicon wafer detection, in particular to a silicon wafer detection device. Background technique [0002] With the development of science and technology, the rise of the global photovoltaic industry has been brought about. Among them, silicon wafer is one of the important materials in the photovoltaic industry. As the carrier of solar cells, the quality of silicon wafers determines the conversion efficiency of solar cells. Therefore, detecting defects such as cracks on silicon wafers is the key to making solar cells. important link. [0003] With the development of industrial technology, the speed of the silicon wafer production line continues to increase, and manual inspection is limited in speed and cannot keep up with the speed of the production line. Therefore, it is imperative to replace manual inspection with machine vision inspection. High-speed trigger cameras are used to take pictures of silico...

AI Technical Summary

Problems solved by technology

In the existing technology, the imaging effect of the device used to detect hidden cracks in silicon wafers is poor, and cannot be clearly displayed on the image, and the accuracy of silicon wafer detection results cannot be guaranteed.

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