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Molded air-cavity package and device comprising the same

An air cavity and molding technology, applied to electrical components, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as variable capacity, air leakage, and large gaps

Pending Publication Date: 2021-12-07
AMPLEON NETHERLANDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the hard stop feature of known packages extends around the entire perimeter of the package, placing the cover 8 may result in the cover 8 being in an unpredictable tilted posture relative to the lower portion 14
This posture may result in a large gap between the cover 8 and the lower part 14
This gap may present a risk of air leakage, reducing the lifetime of the package
Furthermore, the unpredictable pose of the cover 8 relative to the lower portion 14 may cause the channel 12 to have varying volume across the package
This can lead to too much adhesive in the channel in certain poses, with the risk of adhesive flowing inside the package, for example onto the leads 3A, which could lead to field failures

Method used

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  • Molded air-cavity package and device comprising the same
  • Molded air-cavity package and device comprising the same
  • Molded air-cavity package and device comprising the same

Examples

Experimental program
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Embodiment Construction

[0046] Figure 3A and Figure 3B Two respective cross-sectional views of an embodiment of a molded air cavity package according to the present invention are shown. more specifically, Figure 3A A cross-sectional view at the position of the lead wire 3 is shown. and figure 1 Compared with the overall structure of Figure 3A The embodiment in includes a post 100 disposed in a corner of the package. The column is in Figure 3B shown in .

[0047] Figure 3B A cross-sectional view at the location of column 100 is shown. As shown, post 100 extends downwardly from cover base 8A and abuts support surface 6 . Figure 3B The support surface 6 in the Figure 3A The upper surfaces of the lead terminals 3A are coplanar.

[0048] exist Figure 3B In the embodiment shown, the first cover support element is formed by a stud-shaped protrusion, while the second cover support element is formed by a flat portion of the support surface 6 .

[0049] although Figure 3A and Figure 3...

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PUM

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Abstract

The present invention relates to a molded air-cavity package and a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency 'RF' applications including but not limited to RF power amplifiers. Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.

Description

technical field [0001] The present invention relates to molded air cavity packages. Furthermore, the invention relates to a device comprising such an air cavity package. In particular, the present invention relates to molded air cavity packages for radio frequency "RF" applications, including but not limited to RF power amplifiers. Background technique [0002] Some embodiments of molded air cavity packages according to the present invention have figure 1 The structural features of the package are schematically shown in . More specifically, some embodiments of molded air cavity packages according to the invention comprise a thermally conductive mounting substrate 1 , for example in the form of a copper, aluminum or other metal or alloy substrate. Alternatively, laminate substrates, printed circuit boards or lead frame die pads may be used. exist figure 1 A thermally conductive mounting substrate 1 is shown with a semiconductor die 2 mounted thereon. Typically, a layer ...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L23/31
CPCH01L23/49548H01L23/49565H01L23/315H01L23/66H01L23/047H01L23/10H01L23/20H01L23/544H01L2223/54426H01L2223/54486H01L23/36H01L2224/73265H01L2924/16315H01L2924/1632H01L2924/1631H01L2223/6644H01L24/48H01L2224/48247H01L2224/32225H01L2224/32245H01L2924/15724H01L2924/15747H01L2224/291H01L2224/2919H01L2224/29339H01L2224/8384H01L2224/16227H01L24/16H01L24/29H01L24/32H01L2924/16152H01L2924/1616H01L2224/48227H01L2224/48235H01L2924/171H01L2224/48091H01L2224/45099H01L2924/00014H01L2924/014H01L2924/00H01L23/057H01L23/08
Inventor 伦纳度斯·希德罗瑞斯·玛莉亚·拉本方济各·格拉尔杜斯·玛莉亚·梅乌森简·约瑟夫·布里奥尼斯·米兰达
Owner AMPLEON NETHERLANDS