Temporary protective coating demoulded by redox

Abstract

The invention belongs to the technical field of coatings and relates to a temporary protective coating demoulded by redox. At present, holes are almost directly drilled in the surface of a multi-layer PCB through a drill pin, and due to the fact that the surface of the multi-layer PCB is not provided with an auxiliary coating, copper cuttings are extremely prone to being generated in the drilling process, and the drilling precision is seriously affected. Aiming to solve the above problems, the invention provides the temporary protective coating demoulded by redox. After the temporary protective coating coats on the surface of a PCB and cured, the PCB to be drilled can be protected, copper cuttings are prevented from being generated on the circuit board, and the influence of drilling operation on the precision of the PCB is avoided.

Description

technical field [0001] The invention relates to the technical field of coatings, in particular to a temporary protective coating relying on oxidation-reduction stripping. Background technique [0002] As the core component of electronic products such as mobile phones, PCB circuit boards are constantly developing in the direction of high precision. In order to increase the density of fixed-volume circuits in the electronics manufacturing industry, high-density interconnected printed circuit boards have been developed. Through the superposition of multi-layer circuit boards, they are separated from each other by insulating layers. The traditional method is to drill holes between the insulating layers, and then plate the holes with metal to realize the conduction of the circuits between the layers of circuits, so as to greatly increase the circuit density. [0003] Laser drilling directly on the surface of the circuit board is very easy to produce copper scraps, which will aff...

AI Technical Summary

Problems solved by technology

[0003] Laser drilling directly on the surface of the circuit board is very easy to produce copper scraps, which will affect the accuracy of the drilling, and this method can only be applied to multi-layer circuits with fewer layers. For multi-layer boards with more layers , it can only be done with a drill. At present, almost all multi-layer PCB boards are drilled directly on the surface with a drill. Since there is no auxiliary coating on the surface of the multi-layer PCB, copper scraps are easily generated during the drilling process, which is serious. Affect the accuracy of drilling. In order to solve this problem, the present invention prepares a temporary protective coating relying on oxidation-reduction stripping, which is coated on the surface of the circuit board before drilling to form a temporary protective coating. The coating can prevent the circuit board from producing copper shavings. After the drilling is completed, soak the circuit board in VC solution to completely peel off the temporary protective coating from the circuit board.

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