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Full-automatic precise sealing device for polymer chips

A fully automatic, polymer technology, applied in the direction of laboratory equipment, laboratory containers, chemical instruments and methods, etc., can solve the problems of chip scalding and manual removal inconvenience, and achieve the effect of convenient manual operation and saving manpower

Active Publication Date: 2021-12-17
姜春梅
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the disadvantages that the above-mentioned patent is not equipped with a device for cooling the chip, after the sealing is completed, the chip is hot and it is inconvenient to take it out manually. The technical problem to be solved by the present invention is to provide a method for Afterwards, the chip can be cooled to make it more convenient to take it out manually, and it is fully automatic. The polymer chip fully automatic precise sealing device only needs to place and take out the chip manually.

Method used

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  • Full-automatic precise sealing device for polymer chips
  • Full-automatic precise sealing device for polymer chips
  • Full-automatic precise sealing device for polymer chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A fully automatic precise sealing device for polymer chips, such as Figure 1-9 As shown, it includes a casing 1, an air pump 2, a first fixed frame 3, a first movable plate 4, a first fixed plate 5, a sealing ring 6, a first movable rod 7, a first spring 8, a heating plate 9, a first Two movable rods 91, the first rubber plate 10, the second spring 11, the power mechanism 12 and the cooling mechanism 13, the air pump 2 is installed on the lower part of the front side of the shell 1, the air pump 2 communicates with the inside of the shell 1, and the upper part of the front side of the shell 1 is connected There is a first fixed frame 3, a first movable plate 4 is slidably connected to the first fixed frame 3, and a through hole is opened on the upper front side of the casing 1, the first movable plate 4 can block the through hole, and the user can pass through the through hole To place and take out the chip, the middle part of the left and right sides of the casing 1 i...

Embodiment 2

[0044] On the basis of Example 1, such as Figure 4 , Figure 9 , Figure 10 , Figure 11 , Figure 12 and Figure 13 As shown, a moving mechanism 14 is also included, and the moving mechanism 14 is used to assist the movement of the third movable plate 137. The moving mechanism 14 includes a third bracket 141, a first rotating shaft 142, a one-way gear 143, a first gear 144, a second A fixed rod 145, the first rack 146, the fourth spring 147, the contact rod 148 and the second rack 149, the inner bottom of the shell 1 is connected with the third bracket 141 and the first fixed rod 145, the first fixed rod 145 is located at the second The rear side of the three brackets 141, the top of the third bracket 141 is rotatably connected with the first rotating shaft 142, the first rotating shaft 142 is connected with the one-way gear 143 and the first gear 144, the one-way gear 143 is located on the left side of the first gear 144, the second The upper part of a fixed rod 145 is...

Embodiment 3

[0049] On the basis of Example 2, such as Figure 4 , Figure 11 , Figure 13 , Figure 14 with Figure 15 Shown, also comprise disengagement mechanism 16 and connecting mechanism 17, be provided with disengagement mechanism 16 between movable frame 155, the first rotating rod 153 and the 3rd movable plate 137, the second fixed rod 152, the first rotating rod 153 and the 3rd movable plate A connecting mechanism 17 is provided between the two rotating rods 154 , and the cooperation between the disengaging mechanism 16 and the connecting mechanism 17 can drive the first rotating rod 153 and the second rotating rod 154 to rotate.

[0050] Disengagement mechanism 16 comprises the fifth spring 161, push block 162, second fixed frame 163, the sixth spring 164 and movable block 165, is covered with the fifth spring 161 on the movable frame 155, and the fifth spring 161 two ends are respectively connected in movable On the frame 155 and the third fixed plate 151, a push block 162 ...

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Abstract

The invention relates to a sealing device, in particular to a full-automatic precise sealing device for polymer chips. According to the full-automatic precise sealing device for the polymer chips, the chips can be cooled after being sealed, manual taking-out is more convenient, full-automatic operation is achieved, and only the chips need to be manually placed and taken out. The full-automatic precise sealing device for the polymer chips comprises a shell, a sucking pump, a first fixing frame, a first movable plate, a first fixed plate, a sealing ring, a first movable rod, a first spring and the like, wherein the sucking pump is installed on the lower portion of one side of the shell. The chips are clamped through first rubber plates, after the chips are clamped, the two chips are driven to be attached to each other through a power mechanism, after the two chips are attached to each other, the chips can be heated and sealed through a heating plate, and then the effect of sealing the chips is achieved.

Description

technical field [0001] The invention relates to a sealing device, in particular to a fully automatic precise sealing device for polymer chips. Background technique [0002] The microfluidic chip is a polymer chip composed of a variety of conventional materials such as silicon wafers, glass, PDMS, PMMA, and PC. When performing most applications on the microfluidic chip, it is usually necessary to transfer the flow on the microfluidic chip The road is sealed to form a closed pipeline. [0003] After retrieval, the authorized patent publication number is CN209367797U, which discloses a sealing device for polymer chips, including a body, a placement plate is fixedly connected between the inner walls of the body, and an inverted wall is fixedly connected to the upper side wall of the placement plate. A semi-circular glass cover is provided, and a socket is opened on the semi-circular glass cover. A vacuum mechanism is provided in the body, and the vacuum mechanism includes a vac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01L3/00
CPCB01L3/502707B01L2200/12
Inventor 姜春梅
Owner 姜春梅
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