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Mobile phone heat dissipation structure and mobile phone with mobile phone heat dissipation structure

A mobile phone heat dissipation structure and heat sink technology, which is applied to the structure of the phone, the structural parts of electrical equipment, and the modification through conduction and heat transfer, etc. , to avoid normal viewing, good heat dissipation, and the effect of mentioning the service life

Inactive Publication Date: 2021-12-21
广东正品智慧科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the advancement of science and technology, mobile phone technology has also made rapid progress. Now the functions of smart phones are becoming more and more powerful, and behind the powerful functions is the high-frequency work of the electronic components in the mobile phone. During this process, the heat generated by the electronic components of the mobile phone is It is very large, and in order to pursue the aesthetics of the current mobile phone, the thickness of the fuselage also becomes smaller, so that the mobile phone will obviously become hot after a long time of use, which will affect the normal use of the mobile phone; The hot phenomenon after time use is because the internal heat energy of the mobile phone cannot be quickly transferred to the outside world, resulting in excessive heat accumulation inside the mobile phone. Excessive heat energy accumulation in the mobile phone will also have a certain impact on the components inside the mobile phone. It will cause some mobile phone components to fail to work normally or even permanently damaged; therefore, it is necessary to design a mobile phone heat dissipation structure and a mobile phone with a mobile phone heat dissipation structure

Method used

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  • Mobile phone heat dissipation structure and mobile phone with mobile phone heat dissipation structure
  • Mobile phone heat dissipation structure and mobile phone with mobile phone heat dissipation structure
  • Mobile phone heat dissipation structure and mobile phone with mobile phone heat dissipation structure

Examples

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Embodiment Construction

[0022] Such as Figure 1-8 As shown, the present invention provides a mobile phone cooling structure, including a surface frame 1, a bottom frame 2, a PCB circuit board 3 and a battery 4, the surface frame 1 is arranged above the bottom frame 2, the surface frame 1 and the bottom frame The inner surface of the frame 2 is provided with a housing cooling fin 5, and the inner surface of the housing cooling fin 5 is provided with a housing heat-conducting silica gel sheet 6, and the four corners of the bottom frame 2 are provided with through holes 7. A heat conduction mechanism is provided in the through hole 7, and a matching groove is provided at the top of the surface frame 1 and the bottom of the bottom frame 2, and a glass module 8 is fitted in the matching groove, and a light-shielding device is arranged on the inner side of the glass module 8. Adhesive tape 9, a plastic frame 10 is provided on the outside of the light-shielding tape 9, a backlight module 11 is provided on ...

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Abstract

A mobile phone heat dissipation structure disclosed by the invention is characterized in that a face frame is arranged above a bottom frame, shell heat dissipation sheets are arranged on the inner side surfaces of the face frame and the bottom frame, shell heat conduction silica gel sheets are arranged on the inner side surfaces of the shell heat dissipation sheets, through holes are formed in the four corners of the bottom frame, heat conduction mechanisms are arranged in the through holes, matching grooves are formed in the top part of the face frame and the bottom part of the bottom frame, glass modules are arranged in the matching grooves in a matched mode, shading adhesive tape is arranged on the inner sides of the glass modules, a rubber frame is arranged on the outer side of the shading adhesive tape, a backlight module is arranged on the inner side of the rubber frame, a heat dissipation coating is arranged on the inner side surface of the backlight module on the face frame, a shielding cover is arranged on the inner side surface of the backlight module on the outer side of the heat dissipation coating, and a heat dissipation mechanism is arranged in the shielding cover. The invention further discloses a mobile phone with the mobile phone heat dissipation structure. The mobile phone comprises the mobile phone heat dissipation structure and a mobile phone shell, wherein the mobile phone shell is arranged on the outer side of the face frame and the outer side of the bottom frame. The mobile phone heat dissipation structure has good heat dissipation effect, and reduces heat energy accumulation in the mobile phone.

Description

technical field [0001] The invention relates to the technical field of mobile phones, in particular to a mobile phone cooling structure and a mobile phone with the mobile phone cooling structure. Background technique [0002] With the advancement of science and technology, mobile phone technology has also made rapid progress. Now the functions of smart phones are becoming more and more powerful, and behind the powerful functions is the high-frequency work of the electronic components in the mobile phone. During this process, the heat generated by the electronic components of the mobile phone is It is very large, and in order to pursue the aesthetics of the current mobile phone, the thickness of the fuselage also becomes smaller, so that the mobile phone will obviously become hot after a long time of use, which will affect the normal use of the mobile phone; The hot phenomenon after time use is because the internal heat energy of the mobile phone cannot be quickly transferred...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H04M1/02
CPCH05K7/2039H05K7/20409H05K7/20509H04M1/026H04M1/0277
Inventor 陈建国
Owner 广东正品智慧科技股份有限公司