Mobile phone heat dissipation structure and mobile phone with mobile phone heat dissipation structure
A mobile phone heat dissipation structure and heat sink technology, which is applied to the structure of the phone, the structural parts of electrical equipment, and the modification through conduction and heat transfer, etc. , to avoid normal viewing, good heat dissipation, and the effect of mentioning the service life
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[0022] Such as Figure 1-8 As shown, the present invention provides a mobile phone cooling structure, including a surface frame 1, a bottom frame 2, a PCB circuit board 3 and a battery 4, the surface frame 1 is arranged above the bottom frame 2, the surface frame 1 and the bottom frame The inner surface of the frame 2 is provided with a housing cooling fin 5, and the inner surface of the housing cooling fin 5 is provided with a housing heat-conducting silica gel sheet 6, and the four corners of the bottom frame 2 are provided with through holes 7. A heat conduction mechanism is provided in the through hole 7, and a matching groove is provided at the top of the surface frame 1 and the bottom of the bottom frame 2, and a glass module 8 is fitted in the matching groove, and a light-shielding device is arranged on the inner side of the glass module 8. Adhesive tape 9, a plastic frame 10 is provided on the outside of the light-shielding tape 9, a backlight module 11 is provided on ...
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