Neuromorphic chip bonding device with chip overturning function

Abstract

The invention discloses a neuromorphic chip bonding device with a chip overturning function, which comprises a bottom plate, four first air cylinders are fixedly connected to one end of the top of the bottom plate, a transverse plate is fixedly connected among piston rods of the first air cylinders, a vertical plate is fixedly connected to one end of the top of the transverse plate. A top plate is fixedly connected to the top of the vertical plate, a conveying mechanism is arranged at the position, located below the top plate, of the top of the transverse plate, and second air cylinders are fixedly installed at the two ends of the bottom of the top plate. The chip bonding device is compact in structure, easy and convenient to operate and high in practicability, the conveying mechanism is arranged to be matched with the air cylinders, chips can be fixed, so that joint machining operation with the fixed angle can be conveniently conducted on the chips; meanwhile, a belt wheel is arranged for transmission, so that the chip can be overturned in all directions, an operator can conveniently and accurately machine the chip from different machining angles, the joint machining efficiency is greatly improved, and actual application and operation are facilitated.

Description

technical field [0001] The invention belongs to the technical field of chip processing and manufacturing, in particular to a neuromorphic chip bonding device with the function of flipping chips. Background technique [0002] In existing life, chip is a general term for semiconductor component products, or microcircuit, microchip, chip / chip. In electronics, it is a way to miniaturize circuits and is often manufactured on the surface of semiconductor wafers. There are many types of chips, and neuromorphic chips are one of them. When installing and assembling neuromorphic chips, it is usually necessary for senior technicians to manually bond the electronic components on the chip. During this process, a bonding device is required. The chip is effectively fixed, and then the electronic components on the chip are manually bonded by senior technicians. [0003] When bonding neuromorphic chips, since there are many electronic circuits in neuromorphic chips, the processing angle of ...

AI Technical Summary

Problems solved by technology

[0003] When bonding neuromorphic chips, since there are many electronic circuits in neuromorphic chips, the processing angle of the chips must be adjusted frequently, so as to facilitate the precise processing of chips by workers and masters. However, the existing neuromorphic chip bonding Most of the devices only have a fixed structure, and cannot flip the neuromorphic chip that needs to be bonded, resulting in low processing efficiency, which is not conducive to actual application and operation

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