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Plate small hole laser cutting device and using method thereof

A cutting device and hole laser technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., to reduce safety problems, improve safety, and be simple and easy to operate.

Inactive Publication Date: 2021-12-31
广东铭鑫机电装配科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to alleviate the problems caused by high-temperature metal residues and improve the safety of use, the application provides a small hole laser cutting device for plates and its use method

Method used

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  • Plate small hole laser cutting device and using method thereof
  • Plate small hole laser cutting device and using method thereof
  • Plate small hole laser cutting device and using method thereof

Examples

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Embodiment Construction

[0042] The following is attached Figure 1-4 The application is described in further detail.

[0043] The embodiment of the present application discloses a small hole laser cutting device for a plate. refer to figure 1 The cutting device includes a cutting machine body 1 and an air suction mechanism 2. The cutting machine body 1 includes a base 14, a cutting frame 11, a cutting seat 12 and a cutting knife 13. The cutting frame 11 is slidably connected to the top of the base 14, and the cutting seat 12 is slidably connected to the The cutting frame 11 and the cutting knife 13 are arranged on the side of the cutting seat 12 close to the top of the base 14 .

[0044] refer to figure 2 and image 3 The suction mechanism 2 includes a mounting block 3 , a rotating rod 4 , a locking assembly 5 , a translation assembly 6 and an air suction assembly 7 . The locking assembly 5 is rotatably connected to the rotating rod 4 , and the cutting base 12 is provided with a locking groove ...

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PUM

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Abstract

The invention relates to the field of cutting devices, in particular to a plate small hole laser cutting device and a using method thereof. The plate small hole laser cutting device comprises a cutting machine body, wherein the cutting machine body comprises a base, a cutting frame, a cutting seat and a cutting knife, the cutting frame is slidably connected to the top of the base, the cutting seat is slidably connected to the cutting frame, and the cutting knife is connected with the cutting seat; the cutting device further comprises an air suction mechanism, wherein the air suction mechanism comprises a mounting block, a rotating rod, a locking assembly and an air suction assembly, the mounting block is detachably connected to the cutting seat, and the mounting block is slidably connected with the cutting seat; the rotating rod is rotationally connected to the mounting block; the locking assembly comprises a locking gear and a locking rack, wherein the locking gear is fixedly connected to the rotating rod, the locking rack is meshed with the locking gear, and the locking rack is inserted into the cutting seat; and the air suction assembly corresponding to the position of the cutting knife is connected with the locking rack. The device has the effects that the problems caused by high-temperature metal residues are solved, and the use safety is improved.

Description

technical field [0001] The present application relates to the field of cutting devices, more specifically, it relates to a small hole laser cutting device for plates and a method for using the same. Background technique [0002] Laser cutting machine is a kind of laser equipment. Laser cutting is a laser beam emitted by a laser, which is focused by a lens. The workpiece at its focal point is irradiated by a high-power-density laser spot, which generates local high temperature and instantly vaporizes the workpiece. The cutting gas blows the vaporized metal away, cutting a tiny hole through the workpiece. With the movement of the CNC machine tool, countless small holes are connected to form the shape to be cut. [0003] During the process of cutting plates, especially metal plates, the laser will cause many metal residues to fly around. The temperature of these metal residues is particularly high, which may cause great safety hazards. Therefore, there is room for improvement...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/16B23K26/382B23K26/70
CPCB23K26/382B23K26/16B23K26/702
Inventor 袁锦祥
Owner 广东铭鑫机电装配科技有限公司
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