Processing method of microwave circuit board and microwave circuit board manufactured by same

Abstract

The invention discloses a processing method of a microwave circuit board, and discloses a microwave circuit board manufactured and formed by adopting the processing method of the microwave circuit board. The processing method of the microwave circuit board comprises the processing steps that a first protective layer is pasted on the whole microwave circuit board; laser equipment calls laser data, and primary laser forming treatment is carried out on the microwave circuit board; the first protective layer is torn down after primary laser forming, a second protective layer is pasted, laser equipment calls laser data, and secondary laser forming treatment is carried out on the microwave circuit board; and all the protective layers on the microwave circuit board are torn off. Laser forming treatment is performed after the protective layer is pasted, so that carbon blackening at the edge position of the unit board of the microwave circuit board can be effectively reduced; and the working efficiency can be improved by tearing off the protective layer of the whole block, calibration of a production plan can be facilitated while the production cycle is shortened, and meanwhile, labor input can be reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a method for processing microwave circuit boards. Background technique [0002] With the advancement of science and technology, electronic products have become indispensable daily necessities in people's lives, and printed circuit boards, referred to as PCB, are an important part of electronic products. In recent years, people have more and more functional requirements for electronic products. As a result, higher requirements were put forward for the PCB, and the microwave circuit board was invented. [0003] At the present stage, when the microwave circuit board is formed by laser, the edge of the circuit board is carbonized, which needs to be treated with carbonization. It takes a long time to deal with carbides; and when dealing with laser carbides, the easy-to-scratch filter will affect the signal transmission. In addition, after the laser, the prot...

AI Technical Summary

Problems solved by technology

[0003] At the present stage, when the microwave circuit board is formed by laser, the edge of the circuit board is carbonized, which needs to be treated with carbonization. It takes a long time to deal with carbonization; and when processing laser carbonization, the easy-to-scratch filter affects signal transmission

In addition, after the laser, the protective layer on the unit board is still attached to the unit board, so after laser forming, a blade needs to be used to remove the protective layer on the unit board. The time for each unit board to tear the protective layer is about 10-20 seconds. Production efficiency is low and has a serious impact on planned delivery

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