A conductive adhesive test module
A technology for testing modules and conductive adhesives, which is applied in the preparation of test samples, measuring devices, sampling, etc., which can solve the problem of reducing the test accuracy of the bonding ability of conductive adhesives, the contact between conductive adhesives and the surface of material plates, and affecting the bonding of conductive adhesives Capability testing and other issues to achieve the effect of ensuring accuracy, avoiding inconsistency in size, and consistent contact area
Active Publication Date: 2022-02-08
深圳市利群联发科技有限公司
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Problems solved by technology
[0003] At present, the existing test modules usually have the following deficiencies when performing gluing tests on conductive adhesives: 1. The existing test modules usually apply the conductive adhesive to the surface of the material board manually, and the conductive adhesive and the surface of the material board Partial contact is easy to occur, thereby reducing the accuracy of the conductive adhesive bonding ability test; 2. The existing test modules usually apply the conductive adhesive to the surface of the material board manually, and the conductive adhesive applied on different material boards The area is inconsistent, which affects the test of the bonding ability of the conductive adhesive and reduces the accuracy of the test results
Method used
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[0028] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0029] refer to Figure 1-Figure 4 , a conductive adhesive test module, including a placement board 1, a placement device 2, a glue filling device 3 and a pressure device 4, the upper end of the placement board 1 is sequentially installed with a placement device 2 and a pressure application device from left to right In the device 4, the glue filling device 3 is installed in the middle of the placement device 2, and the pressure applying device 4 is fixedly connected with the placement device 2.
[0030] refer to Figure 5 , Figure 6 and Figure 8 , the placement device 2 includes a mounting plate 21, a rectangular block 22, a placement ring frame 23, a limiting plate 24, a limiting spring 25, a cylindrical rod 26, a gathering ring plate 27, a cu...
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The present invention relates to the technical field of conductive adhesive detection, in particular to a conductive adhesive testing module, which includes a placement board, a placement device, a glue filling device and a pressure device. The top of the placement board is sequentially installed with placement device and a pressure device, a glue filling device is installed in the middle of the placement device, and the pressure device is fixedly connected with the placement device. The present invention can solve the problem that the existing test module usually applies the conductive glue to the surface of the material plate manually when performing the glue test on the conductive glue. The accuracy of the glue bonding ability test and other issues. The glue filling device used in the conductive adhesive test module provided by the present invention can cling to and fill the surface of the material plate when it is attached to the material plate, so as to avoid the phenomenon that the conductive adhesive is partially connected to the surface of the material plate after curing, ensuring The accuracy of the bonding ability test of conductive adhesives.
Description
technical field [0001] The invention relates to the technical field of conductive adhesive detection, in particular to a conductive adhesive testing module. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It can connect a variety of conductive materials together to form an electrical path between the connected materials. In the electronics industry, conductive adhesives have become an indispensable new material; conductive adhesives need to be checked after processing and production. And electrical conductivity test, remove the bad products, and let the qualified products flow into the market. [0003] At present, the existing test modules usually have the following deficiencies when performing gluing tests on conductive adhesives: 1. The existing test modules usually apply the conductive adhesive to the surface of the material board manually, and the conductive adhesive and the surface of the material board...
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IPC IPC(8): G01N19/04G01N1/28B05C5/00B05C13/02B05C11/10
CPCG01N19/04G01N1/2813G01N1/286B05C5/004B05C13/02B05C11/1005
Inventor 彭建军熊乔兴肖红勤
Owner 深圳市利群联发科技有限公司
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