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94results about How to "Lower contact barrier" patented technology

Thin-film transistor structure

The invention discloses a thin-film transistor structure. The thin-film transistor structure comprises a source, a drain, a semiconductor layer and a grid, wherein the drain and the source are arranged at an interval; the grid is arranged in an insulation manner relative to the semiconductor layer, the source and the drain through an insulation layer; an ohmic contact layer is further arranged between the semiconductor layer and the source and the drain, and the ohmic contact layer further comprises a first phosphorus-doped layer, a second phosphorus-doped layer and a third phosphorus-doped layer which are stacked, wherein the first phosphorus-doped layer is close to the semiconductor layer, the third phosphorus-doped layer is close to the source and the drain, the phosphorus doping concentration of the first phosphorus-doped layer is lower than that of the second phosphorus-doped layer, and the phosphorus doping concentration of the second phosphorus-doped layer is lower than that of the third phosphorus-doped layer. The thin-film transistor structure disclosed by the invention can reduce a contact potential barrier between a semiconductor and a metal to form good ohmic contact between the two and further effectively reduce the drain current of the amorphous silicon thin-film transistor without affecting the on-state current.
Owner:TRULY HUIZHOU SMART DISPLAY

Bottom electrode type flexible perovskite solar cell and preparation method thereof

The invention discloses a bottom electrode type flexible perovskite solar cell and a preparation method thereof. The bottom electrode type flexible perovskite solar cell comprises a forward structureand a backward structure; the forward structure comprises a flexible substrate, a bottom electrode, an electron transport layer, a perovskite layer, a hole transport layer and an electrode from the bottom up in sequence; the backward comprises a flexible substrate, a bottom electrode, a hole transport layer, a perovskite layer, an electron transport layer and an electrode from the bottom up in sequence; and the bottom electrode layer adopts a metal nanomaterial and / or a conductive polymer material. On one hand, by virtue of setting of the bottom electrode, the flexibility and bendable propertyof the flexible perovskite solar cell can be improved to a certain degree, so the number of times of bending of the flexible perovskite solar cell can be increased, and a new approach is provided forpracticability of the flexible perovskite solar cell; and on the other hand, by virtue of addition of the bottom electrodes, the contact barrier between the bottom electrodes and the electron transport layer can be lowered, the series resistance is lowered, the filling factor and the current density are improved, the energy conversion efficiency is improved effectively, and feasibility is provided for commercialization of the flexible perovskite solar cell is provided.
Owner:JIMEI UNIV

Organic electroluminescence device and preparation method thereof

The invention belongs to the field of electroluminescence devices and discloses an organic electroluminescence device and preparation method thereof. The organic electroluminescence device comprises an anode substrate, a hole injection layer, a hole transport layer, an electron barrier layer, a luminescent layer, a buffer layer and a cathode layer, wherein the anode substrate, the hole injection layer, the hole transport layer, the electron barrier layer, the luminescent layer, the buffer layer and the cathode layer are sequentially laminated. The material of the buffer layer is metal fluoride. By arranging the buffer layer between cathodes and the luminescent layer, permeation on the luminescent layer from the cathodes can be effectively avoided, and transmission performance of electrons is protected. Meanwhile, fluorine in the buffer layer can form bonding effect with material of the cathode layer so that Fermi level of the buffer layer and the cathode layer can be reduced to the same level, the band of the buffer layer can be bent, contact potential barriers of the luminescent layer and the cathode layer can be effectively reduced, energy needing to be overcome when the electrons are transmitted to the luminescent layer is reduced, transmission capacity of the electrons in the organic electroluminescence device is improved, and therefore luminous efficiency of the organic electroluminescence device is achieved.
Owner:OCEANS KING LIGHTING SCI&TECH CO LTD +1

Low-on-resistance trench silicon carbide power device and manufacturing method thereof

The invention discloses a low-on-resistance trench silicon carbide power device and a manufacturing method thereof. The cellular structure comprises an N-type substrate, an N-type epitaxial layer anda trench; a graphene layer is arranged on the side wall of the trench; a gate oxide layer and a polycrystalline silicon gate are arranged in the trench; a passivation layer is arranged above the polycrystalline silicon gate; a P-type body region, an N-type source region and a P-type body contact region are arranged on the two sides of the trench; a P-type shielding layer is arranged below the graphene layer; source metal is arranged on the upper surface of the source region; and drain metal is arranged on the lower surface of the substrate. According to the power device, an electron beam method is used, metal and a carbon source gas are used for assisting, and the graphene layer grows on the side wall of the trench. The power device is characterized in that the graphene layer on the side wall of the trench reduces the on resistance. The shielding layer below the graphene layer shields the current flowing through the graphene layer when the device is in an off state, and the turn-off characteristic of the device is improved. The growth of the graphene layer is assisted by metal nickel and the carbon source gas, so that the uniformity, the thickness and the growth rate of the graphene layer are improved.
Owner:SOUTHEAST UNIV

Thin film transistor and manufacturing method thereof as well as array substrate and display device

The invention relates to the display technology field, in particular to a thin film transistor and a manufacturing method thereof as well as an array substrate and a display device. The thin film transistor comprises an active layer (3), a doping layer (2) and a source/drain electrode layer (1), wherein the doping layer (2) is located between the active layer (3) and the source/drain electrode layer (1) and comprises at least two sub-doping layers, the doping concentration of dopant of the source/drain electrode sub-doping layer (4) close to the source/drain electrode layer (1) is larger than that of the dopant of an active sub-doping layer (5) close to the active layer (3), and the doping concentration of dopant of the active sub-doping layer (5) is larger than 0. According to the thin film transistor and the manufacturing method thereof as well as the array substrate and the display device, the technical problem that the contact resistance between the doping layer and the source/drain electrode layer and the contact resistance between the doping layer and the active layer cannot be reduced simultaneously in the prior art is solved, and the thin film transistor and the manufacturing method thereof as well as the array substrate and the display device can be applied to the display technology field.
Owner:BOE TECH GRP CO LTD +1

Preparation method of laminated transparent conducting layer LED (light emitting diode) chip

ActiveCN102832299AReduce the driving voltageExternal Quantum Efficiency RetentionSemiconductor devicesQuantum efficiencyRefractive index
The invention provides a preparation method of a laminated transparent conducting layer LED (light emitting diode) chip structure and the laminated transparent conducting layer chip structure. The preparation method comprises the following steps of: 10), providing an LED epitaxial wafer; 20) carrying out Mesa treatment on the LED epitaxial wafer, so that a N-GaN layer of the epitaxial wafer can be exposed; 30) depositing a first transparent electric layer with high work function on the unexposed surface of the epitaxial wafer; 40) depositing a second transparent electric layer on the first transparent electric layer; and 50) plating a P electrode and an N electrode in an evaporation way, so as to an LED COW structure. According to the preparation method, a layer of new film layer with high work function is inserted between a transparent electric film layer film and a P-GaN, so that the contact-potential barrier between the transparent electric film layer film and the P-GaN can be reduced, the driving voltage of the chip can be reduced, and the LED external quantum efficiency can be guaranteed since the refractive index of the inserting layer is between refractive indexes of an ITO (indium tin oxide) film layer and the P-GaN or is equal to the refractive index of the transparent electric film layer arranged above the inserting layer.
Owner:广东昭信集团股份有限公司

Ag(Ti,Zr)/rare earth crystalline silicon solar cell composite sizing agent and manufacturing method of Ag(Ti,Zr)/rare earth crystalline silicon solar cell composite sizing agent

The invention relates to an Ag(Ti,Zr) / rare earth crystalline silicon solar cell composite sizing agent and a manufacturing method of the Ag(Ti,Zr) / rare earth crystalline silicon solar cell composite sizing agent. The Ag(Ti,Zr) / rare earth crystalline silicon solar cell composite sizing agent comprises, by mass, 0.1-0.4 parts of glass binders, 7.5-8 parts of ultra-fine silver powder, 0.2-0.5 parts of mixtures of ultra-fine TiO2 powder and ultra-fine ZrO2 powder, 0.1 parts of rare earth powder, 1-1.4 parts of organic binders and 0.3-0.4 parts of diluents. By means of the Ag(Ti,Zr) / rare earth crystalline silicon solar cell composite sizing agent and the manufacturing method, a small amount of rare earth addition Ce, Eu or Gd is doped into the sizing agent containing Ti and Zr, the rare earth is a medium for forming Ag / Si contact, the silver-silicon contact in the sintering process of cell manufacturing is compact, and the contact resistance and the electrode attachment force are further reduced. Meanwhile, the contact resistance between silk screen printing silver paste and a silicon substrate is reduced, the electrode attachment force is improved, consumption of metal silver is reduced, the crystalline silicon solar cell efficiency is improved, and the cell cost is reduced.
Owner:XI AN JIAOTONG UNIV +1

A kind of transparent conductive film with enhanced thermal stability and its preparation method and application

The invention relates to a transparent conducting thin film with enhanced thermal stability and a preparation method and application thereof. The transparent conducting thin film consists of a substrate, a first semiconductor layer, a silver alloy layer and a second semiconductor layer sequentially from bottom to top; according to the silver alloy layer, metal silver is combined with aluminum, zinc, titanium, copper, magnesium, nickel, rare earth elements or chromium to form a bi-element silver alloy layer or a multi-element silver alloy layer. The transparent conducting thin film provided by the invention can be used for photoelectric devices, such as organic light-emitting devices (OLEDs), organic solar cells and perovskite batteries; furthermore, on the basis of improving the thermal stability of the photoelectric devices, the dose of the photoelectric devices on a silver material per unit area can be reduced, device cost can be beneficially controlled, resources are saved; and the transparent conducting thin film also can be applied to magnetic shielding, special functional window coatings, transparent heat preservation building glass and the like.
Owner:SHANGHAI UNIVERSITY OF ELECTRIC POWER
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