A kind of preparation method of helical graphene film/copper layered composite material

Abstract

The invention discloses a preparation method of a helical graphene film / copper layered composite material. The method comprises: 1. bonding a highly oriented graphene film and a hot-melt pressure-sensitive double-sided adhesive, and then heat-treating, then ultrasonically Soaking the copper powder in ethanol slurry to obtain a highly oriented graphene film preform; 2. preparing a zirconium microalloyed copper block; Vinyl film / copper layered composites. In the invention, the gas pressure infiltration method is used to immerse the microalloyed copper block melt into the spiral gap of the highly oriented graphene film preform and generate nanometer thick carbides in situ, thereby realizing the spiral graphene film / copper layered composite material. The improvement of the interfacial bonding strength and the uniform distribution of the graphene film improves the mechanical properties of the composite material, and solves the problem of the small loading of graphene as a copper matrix reinforcement, many graphene / copper interfaces, disordered graphene orientation, and enhanced thermal conductivity. The problem of limited action.

Description

technical field [0001] The invention belongs to the technical field of thermal management materials, and in particular relates to a preparation method of a helical graphene film / copper layered composite material. Background technique [0002] With the continuous improvement of the integration of components on the chip, the resulting large amount of heat directly affects the working stability and safety and reliability of electronic devices, so there is an urgent need for high thermal conductivity materials. The thermal conductivity of traditional thermal conductive materials is lower than 300W / mK, which can no longer meet the increasingly high usage requirements. At present, carbon materials (graphene, carbon nanotubes, diamond, etc.) reinforced copper matrix composites are leading the research and development boom and become the latest generation of high thermal conductivity materials. Graphene, in particular, is currently the material with the best thermal conductivity, s...

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Problems solved by technology

However, the thermal conductivity of graphene-reinforced copper matrix composites reported so far is not high (<500W / mK) (Powder Technology, 2016, 301, 601-607; Journal of Alloys and Compounds, 2019, 771: 228-237)

[0003] The traditional preparation method often used in graphene-reinforced composite materials is to uniformly disperse graphene nanosheets in the copper matrix, and improve the orientation degree of graphene through a special process, but it cannot solve the problem of too small graphene loading and graphite Problems such as too many olefin / copper interfaces

The loading rate of graphene in the metal matrix is ​​generally not more than 5wt.%. According to the thermal conductivity formula of the composite material, the thermal conductivity enhancement effect is not significant if the loading of the reinforcement is too small. If the loading of graphene is increased, graphene will appear serious. The problem of agglomeration increases the disorder. Even if the degree of orientation is improved, it cannot offset the high interfacial thermal resistance caused by the introduction of a large number of interfaces by graphene nanosheets, which is not conducive to the improvement of the thermal conductivity of composite materials.

Therefore, although the thermal conductivity of single-layer graphene is super high, it is not suitable to be directly added to the copper matrix as a thermal conductivity enhancer, otherwise graphene will be difficult to get rid of the mutual constraints of layer orientation, loading capacity, number of interfaces and other factors, and it is difficult to balance the dilemma

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