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Packaging method and packaging structure of display panel

An encapsulation method and display panel technology, which are applied to electrical components, electrical solid-state devices, circuits, etc., can solve the problems that the encapsulation structure is difficult to achieve high brightness, and the light-emitting device encapsulation is difficult to fill gaps.

Pending Publication Date: 2022-02-11
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above deficiencies in the prior art, the purpose of this application is to provide a packaging method and packaging structure for a display panel, aiming to solve the problems in the prior art that it is difficult to fill gaps in the packaging of light-emitting devices and the packaging structure is difficult to achieve high brightness.

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  • Packaging method and packaging structure of display panel
  • Packaging method and packaging structure of display panel
  • Packaging method and packaging structure of display panel

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Embodiment Construction

[0037] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0039] As described in the background art section, in the prior art, it is diffic...

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Abstract

The invention relates to a packaging method and a packaging structure of a display panel. The packaging method comprises the following steps: providing a display back plate, wherein light-emitting devices are arranged on one side of the display back plate at intervals, and the surfaces of the sides, away from the display back plate, of the light-emitting devices are light-emitting faces; controlling the packaging glue solution to cover the surface, with the light-emitting device, of the display backboard, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution; and solidifying the packaging glue solution to form a packaging layer, and packaging the light-emitting device on the display backboard through the packaging layer. When the light-emitting device is packaged by adopting the packaging method, the packaging glue solution covers the surface, with the light-emitting device, of the display back plate, so that the light-emitting surface is not lower than the liquid level of the packaging glue solution, and based on the flowability of the packaging glue solution, the packaging glue solution is prevented from covering the light-emitting surface while the good gap filling capability is achieved; therefore, packaging of the light-emitting device on the display backboard is completed by curing the packaging glue solution, and the packaging effect of the light-emitting device and efficient light emitting of the light-emitting device are guaranteed.

Description

technical field [0001] The invention relates to the technical field of packaging of light emitting devices, in particular to a packaging method and packaging structure of a display panel. Background technique [0002] At present, as a new generation of display technology, micro-Light Emitting Diode (micro-LED) has the advantages of high brightness, high color gamut, high contrast, and higher viewing angle display, and has become a current research hotspot. Display technology companies are scrambling to deploy Micro-LED, and Micro-LED has broad application prospects in outdoor fields such as wearables and vehicles. [0003] As we all know, the packaging of light-emitting devices, as a necessary process, plays a role in supporting and protecting light-emitting devices. When the light-emitting device is a Micro-LED, its size is reduced to ≤50 μm, and it is inevitable to face the problem of high difficulty in packaging gaps due to small pixel pitch and small gaps. [0004] In ...

Claims

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Application Information

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IPC IPC(8): H01L27/15H01L33/54H01L33/56
CPCH01L27/156H01L33/54H01L33/56H01L2933/005
Inventor 朱维冯磊刘政明
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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