Chip high and low temperature testing device
A test device, high and low temperature technology, applied in the direction of measuring device, electronic circuit test, measuring electricity, etc., can solve the problems of chip test verification, lack of chip high and low temperature test, etc., to improve chip test efficiency and save test time.
Pending Publication Date: 2022-02-15
广东利扬芯片测试股份有限公司
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Problems solved by technology
[0002] With the rapid development of the semiconductor industry, chips are widely used in all aspects of life. Some chips need to work in high and low temperature environments, so these chips must have the ability to work normally in high and low temperature environments. When these chips are designed and produced After it comes out, it needs to verify whether it can work normally in high and low temperature environments. At present, the industry lacks high and low temperature testing devices for chips, so it is impossible to test and verify chips in high and low temperature environments.
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[0024] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.
[0025] Please refer to figure 1 , figure 2 and Figure 4 , the invention discloses a chip high and low temperature testing device, including a box body 1, a first material receiving tray 3, a second material receiving tray 4, a support mechanism 5 and a sealing member 6, and the box body 1 is used to accommodate chips and align them Heating or cooling, the side wall of the box body 1 is provided with a material receiving hole 2; the first material receiving tray 3 and the second material receiving tray 4 are used to carry chips, the first material receiving tray 3 and the second material receiving tray 4 It can be inserted into the box body 1 through the pick-up and discharge hole 2 or pulled out from the box body 1; the support mechani...
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The invention discloses a chip high and low temperature testing device which comprises a box body, a first material bearing disc, a second material bearing disc, a supporting mechanism and a sealing element. The box body is used for accommodating a chip and heating or cooling the chip, and one side wall of the box body is provided with a material taking and placing hole; the first material bearing disc and the second material bearing disc are used for bearing the chip and can be inserted into the box body or pulled out of the box body through a material taking and placing hole. The supporting mechanism is arranged in the box body, and the first material bearing disc and the second material bearing disc are supported on the supporting mechanism when being inwards inserted in place from the material taking and placing hole; and the sealing element can seal the material taking and placing hole. According to the invention, high and low temperature testing of the chip can be realized, the testing efficiency is improved, and the testing time is saved.
Description
technical field [0001] The invention relates to the field of chip testing, in particular to a chip high and low temperature testing device. Background technique [0002] With the rapid development of the semiconductor industry, chips are widely used in all aspects of life. Some chips need to work in high and low temperature environments, so these chips must have the ability to work normally in high and low temperature environments. When these chips are designed and produced After it comes out, it needs to verify whether it can work normally in high and low temperature environments. At present, there is a lack of high and low temperature testing devices for chips in the industry, so it is impossible to test and verify chips in high and low temperature environments. [0003] Therefore, it is particularly important to design a chip high and low temperature testing device that can solve the above problems. Contents of the invention [0004] The object of the present invention...
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IPC IPC(8): G01R31/28
CPCG01R31/2817
Inventor 李双成陈勇马海龙范传敏张永乐张亦锋
Owner 广东利扬芯片测试股份有限公司