Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photocuring 3D printer base heat dissipation structure

A technology for 3D printers and heat dissipation structures, applied in 3D object support structures, additive manufacturing, manufacturing tools, etc., can solve the problems of shortening the service life of 3D printers, low heat dissipation efficiency of fan rotation, and high temperature conditions, so as to reduce heat dissipation sources, Reduce the effect of increasing and prolonging the service life

Active Publication Date: 2022-02-18
SHENZHEN MINGDA TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the related technologies mentioned above, the inventor believes that when the fan rotates to dissipate heat, because the high-speed operation of the 3D printer causes the temperature to rise in a short period of time, the heat dissipation efficiency of the fan rotation is low, which will cause the 3D printer to be in a high temperature state for a long time, shortening the temperature of the 3D printer. service life

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photocuring 3D printer base heat dissipation structure
  • Photocuring 3D printer base heat dissipation structure
  • Photocuring 3D printer base heat dissipation structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The following is attached Figure 1-5 The present invention is described in further detail.

[0040] The embodiment of the present invention discloses a light-curing 3D printer base heat dissipation structure. refer to figure 1The heat dissipation structure of the light curing 3D printer base includes a support 1, a first heat dissipation member 2 and a second heat dissipation member 5, the first heat dissipation member 2 is located on the support 1, the second heat dissipation member 5 is located on the base 81, and the first heat dissipation member 2 and the second heat dissipation member 5 are convenient to accelerate the heat dissipation efficiency of the light source 82 and prolong the service life of the 3D printer 8 .

[0041] refer to figure 1 and figure 2 , the support member 1 includes two connecting plates 11 and two connecting rods 12, the two connecting plates 11 are respectively welded to the two ends of the connecting rod 12, and the two connecting r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a photocuring 3D printer base heat dissipation structure. The structure comprises a supporting piece and a first cooling component, and the cooling component comprises a driving assembly, a plurality of first cooling fins and a plurality of second cooling fins; the driving assembly is used for driving the first cooling fins and the second cooling fins to move synchronously; the first cooling fins and the second cooling fins are arranged on the same side of the light-emitting source, the first cooling fins and the second cooling fins are arranged at intervals, and the first cooling fins are attached to the light-emitting source; when the temperature in the base is lower than or equal to the room temperature, a gap is formed between the second cooling fins and the light-emitting source; and when the temperature in the base is higher than the room temperature, the second cooling fins are attached to the light-emitting source. According to the photocuring 3D printer base heat dissipation structure, through the first cooling fins and the second cooling fins, the contact area of the light-emitting source and the cooling fins is increased, then the heat dissipation efficiency of the light-emitting source is improved, the time of the 3D printer in a high-temperature state is shortened, and then the service life of the 3D printer is prolonged.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of a printer base, in particular to a heat dissipation structure of a light-cured 3D printer base. Background technique [0002] In the era of rapid technological development, people have higher and higher requirements for speed. In order to meet people's requirements, 3D printers have come out; 3D printers are a kind of machine of rapid prototyping technology. Bondable materials such as powdered metal or plastics are used to construct objects by layer-by-layer printing. [0003] In related technologies, because the 3D printer can quickly produce objects, the light source of the 3D printer located in the base will generate heat and needs to be dissipated. Usually, multiple air outlets are opened on the base, and then fans are installed at the air outlets. The heat emitted by the light source is emitted through the air outlet. [0004] In view of the related technologies mentioned above,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/20B29C64/124B33Y30/00
CPCB29C64/20B29C64/124B33Y30/00
Inventor 黄辉平张学聪孙中海
Owner SHENZHEN MINGDA TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com