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Capacitor

A technology for capacitors and casings, which is applied in the field of capacitors and can solve problems such as difficult heat dissipation

Pending Publication Date: 2022-02-18
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the above-mentioned capacitor generates heat from the capacitor element, the heat is difficult to be dissipated to the outside of the case

Method used

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  • Capacitor
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Examples

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Embodiment Construction

[0024] Hereinafter, a film capacitor 1 as an embodiment of the capacitor of the present invention will be described with reference to the drawings. For convenience, front and rear, left and right, and up and down directions are appropriately indicated in each drawing. In addition, the directions shown in the drawings always indicate relative directions of the film capacitor 1 , and do not indicate absolute directions. In addition, for convenience of description, in some structures such as a "bottom surface part" and a "front side part", names corresponding to directions in illustration may be given.

[0025] In this embodiment, the film capacitor 1 corresponds to the "capacitor" described in the claims. In addition, the protrusion part 210 corresponds to the "protrusion part" described in the claim. Furthermore, the first end surface electrode 410 corresponds to the "electrode" described in the claims. Furthermore, the leaf spring part 660 corresponds to the "pressing part"...

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Abstract

Provided is a capacitor in which the metal plate does not easily come off the outside of the case when a configuration is adopted in which a metal plate is insert molded to a case. A film capacitor comprises a capacitor element, a case made of resin and accommodating the capacitor element, a metal plate insert molded in the case, and a filler resin filled into the case. The metal plate comprises: a main plate section having a front surface exposed to the outside from an opening formed in the case; and a to-be-covered section provided at a peripheral edge of the main plate section and covered from the outside at a peripheral edge section of the opening in the case.

Description

technical field [0001] This invention relates to capacitors. Background technique [0002] Conventionally, there has been known a case mold type (kesmolded) capacitor in which impact resistance and moisture resistance are improved by filling a resin case in which a capacitor element is accommodated with a filling resin. In the capacitor described above, when the capacitor element generates heat, the heat is hardly dissipated to the outside of the case. [0003] Therefore, in order to improve heat dissipation from the case, the metal plate can be insert-molded on the side surface or the bottom surface of the case so that the outer surface thereof is exposed to the outside. For example, Patent Document 1 describes a capacitor having such a structure. [0004] In the case molded capacitor of Patent Document 1, a metal plate having a plurality of protrusions on the upper surface is insert-molded on the outer bottom surface of a resin case. A recess is provided on the inner bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G2/10
CPCH01G2/10H01G2/08H01G4/32H01G4/38H01G2/106H01G4/40H01G4/224H01G9/08H01G11/78
Inventor 久村博隆片山秀机
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD