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Curable silicone composition, sealing material, and optical semiconductor device

A technology of silicone and composition, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of insufficient elongation characteristics of cured products, and achieve the effect of excellent reliability

Pending Publication Date: 2022-03-01
DUPONT TORAY SPECIALTY MATERIALS KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, curable silicone compositions of conventional resinous crosslinking agents containing three or more silicon-bonded hydrogen atoms in one molecule have the problem of insufficient elongation characteristics of cured products.

Method used

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  • Curable silicone composition, sealing material, and optical semiconductor device
  • Curable silicone composition, sealing material, and optical semiconductor device

Examples

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example

[0123] The curable silicone composition of the present invention is described in detail by the following examples and comparative examples.

[0124] In the following examples and comparative examples, the raw material components shown below were used. Hereinafter Me represents a methyl group, Vi represents a vinyl group, Ph represents a phenyl group, and Ep represents a 3-glycidoxypropyl group.

[0125] (a) Component: resinous alkenyl group-containing organopolysiloxane

[0126] Component a-1: the number average molecular weight is 1600, by the average unit formula (Me 3 SiO 1 / 2 ) 0.13 (ViMe 2 SiO 1 / 2 ) 0.09 (MeSiO 3 / 2 ) 0.39 (PhSiO 3 / 2 ) 0.39 Expressed resinous alkenyl-containing organopolysiloxane, average number of vinyl groups per molecule: 1.5

[0127] Component a-2: number average molecular weight is 1700, by average unit formula (Me 3 SiO 1 / 2 ) 0.15 (ViMe 2 SiO 1 / 2 ) 0.07 (MeSiO 3 / 2 ) 0.39 (PhSiO 3 / 2 ) 0.39 Expressed resinous alkenyl-containing orga...

Embodiment 1～4 and comparative example 1～3

[0139] Each component was mixed with the composition (mass %) shown in Table 1 and Table 2, and curable silicone composition was prepared.

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Abstract

Provided is a curable silicone composition capable of forming a cured product having excellent elongation characteristics. The present invention relates to a composition comprising (A) a monovalent hydrocarbon group represented by the average unit formula (I): (R13SiO1 / 2) a (R12SiO2 / 2) b (R1SiO3 / 2) c (SiO4 / 2) d (XO1 / 2) e (in the formula (I), R1 is a monovalent hydrocarbon group each independently containing an alkenyl group, where the number of alkenyl groups per molecule is less than 2 on average, X is a hydrogen atom or an alkyl group, 0 < = a < = 1, 0 < = b < = 1, 0 < = clt; 0.9, 0 < = dlt; 0.5, 0 < = ilt; 0.4, a + b + c + d = 1.0, and c + dgt; the problem is solved by a curable silicone composition comprising (A) a resinous alkenyl group-containing organopolysiloxane having an average of less than two alkenyl groups per molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atom-bonded silicon atoms per molecule, and (C) a curing reaction catalyst.

Description

【Technical field】 [0001] The present invention relates to a curable silicone composition, and more specifically, to a curable silicone composition suitable for use as a sealing material for optical semiconductors. Furthermore, the present invention relates to a sealing material comprising a cured product of such a curable silicone composition, and an optical semiconductor device sealed with the sealing material. 【Background technique】 [0002] Curable silicone compositions are widely used as optical materials because they cure to form cured products having excellent heat resistance, weather resistance, and transparency. [0003] For example, Patent Document 1 describes a curable organopolysiloxane composition comprising: (A) having at least two silicon-atom-bonded alkenyl groups and at least one silicon-atom-bonded aromatic group in one molecule; (B) have at least one silicon atom-bonded alkenyl group and at least one silicon atom-bonded aryl group in a molecule, by the gen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05H01L23/29H01L33/56
CPCC09J183/04H01L33/56H01L23/296C08L2203/206C08L83/04C08G77/12C08G77/20C08G77/045C08L83/00C08K5/549C08K5/56C08L2205/025C08G77/08
Inventor 林昭人堀江佐和子
Owner DUPONT TORAY SPECIALTY MATERIALS KK
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