Preparation method of multi-line TRL calibration piece and multi-line TRL calibration piece
A technology of calibration parts and transmission lines, which is applied in the field of microwave characteristic measurement of wafer-level semiconductor devices, and can solve problems such as the lack of preparation methods for multi-line TRL calibration parts
Pending Publication Date: 2022-03-01
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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[0004] The embodiment of the present invention provides a method for preparing a multi-line TRL calibration piece and a multi-line TRL calibration piece, so as to solve the problem that there is currently no method for preparing a multi-line TRL calibration piece
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[0051] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
[0052] In order to make the purpose, technical solution and advantages of the present invention clearer, specific embodiments will be described below in conjunction with the accompanying drawings.
[0053] figure 1 The implementation flowchart of a method for preparing a multi-line TRL calibration piece provided by the embodiment of the present invention is described in detail as follows.
[005...
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The invention provides a preparation method of a multi-line TRL calibration piece and the multi-line TRL calibration piece. The method comprises the steps that the multi-line TRL calibration piece comprises a straight-through part, a plurality of transmission lines and reflectors, the transmission lines are the same as the straight-through part in cross section and different in length, and the method comprises the steps that the cross section sizes of the transmission lines are obtained according to substrate parameters and metal parameters; according to the cross section size of the transmission line, determining a plurality of transmission lines with different lengths and determining the cross section size of an open circuit or the cross section size of a short circuit; performing semiconductor process processing to obtain a calibration piece; and carrying out parameter calibration on the straight-through, transmission line and reflection in the calibration piece to obtain a multi-line TRL calibration piece. According to the invention, the problem of lack of the multi-line TRL calibration piece caused by the absence of the preparation mode of the multi-line TRL calibration piece in China at present can be solved.
Description
technical field [0001] The invention relates to the technical field of microwave characteristic measurement of wafer-level semiconductor devices, in particular to a preparation method of a multi-line TRL calibration piece and the multi-line TRL calibration piece. Background technique [0002] Before measuring the chip under test, the on-chip S-parameter measurement system needs to be calibrated. Common calibration methods include Line-Re-flect-Reflect-Match (Line-Re-flect-Reflect-Match, LRRM) calibrator, open circuit-short circuit - Load-Thru (Short-Open-Load-Thru, SOLT) calibration kits and Thru-Reflect-Line (TRL) calibration kits, etc., are used in conjunction with calibration kits provided by foreign manufacturers. The measurement accuracy of on-chip S-parameters depends on the calibration method and calibration parts used. [0003] With the increasing demand for on-wafer S-parameter measurement, the consumption of commercial on-wafer multi-line TRL calibration parts is ...
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Login to View More IPC IPC(8): G01R35/00
CPCG01R35/00
Inventor 王一帮梁法国吴爱华霍晔栾鹏刘晨孙静徐森锋
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP