Rapid processing method and system for printed circuit board and multilayer board structure
A technology for printed circuit boards and processing methods, which is applied in the fields of printed circuits, printed circuit manufacturing, and multilayer circuit manufacturing, etc. It can solve the problems of cumbersome processing procedures, blind hole quality, and redundancy, and achieve simple processing steps and small diameters of through holes. , the effect of simplifying steps
Pending Publication Date: 2022-03-01
SHENNAN CIRCUITS
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Problems solved by technology
[0007] The technical problem to be solved by the present invention is to provide a printed circuit board and its rapid processing method and rapid processing system in view of the above-mentioned defects of the prior art, which solves the cumbersome and lengthy processing process, and is prone to blind hole quality problems, resulting in Even the problem of poor electrical performance
Method used
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[0042] Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.
[0043] Such as Figure 2 to Figure 4 As shown, the present invention provides a preferred embodiment of a rapid processing method for printed circuit boards.
[0044] The steps of the rapid processing method include:
[0045] Step S11, a plurality of functional boards 210 and adhesive sheets 220 are stacked in sequence, and adhesive sheets 220 are arranged between each functional board 210, and pressed into a printed circuit board;
[0046] Step S12 , using a micro mechanical drill with a diameter of less than 0.1 mm to mechanically drill through holes on the printed circuit board.
[0047]Specifically, since the mechanically drilled through-hole of the micro-mechanical drill can keep the diameter of the through-hole always or close to the same, that is, the aperture of the micro-mechanical drill is or slightly larger than the size of th...
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Abstract
The invention relates to the field of printed circuit boards, in particular to a printed circuit board and a rapid processing method and system thereof. The rapid processing method comprises the following steps: step S11, sequentially laminating a plurality of functional boards and bonding sheets, arranging the bonding sheets between the functional boards, and pressing the functional boards into a printed circuit board; and S12, mechanically drilling a through hole in the printed circuit board by using a micro mechanical drill with the aperture of less than 0.1 mm. Compared with the prior art, the method has the beneficial effects that through hole drilling is realized by adopting the micro mechanical drill bit with the hole diameter smaller than 0.1 mm, and when the method is applied to a multi-layer structure of the printed circuit board, the micro hole diameter of laser drilling can be realized, and the problems of large through hole inclination and many steps caused by laser drilling are solved; the operation of pressing and drilling through holes can be achieved at a time, and interconnection structures among the functional boards are achieved.
Description
technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board, a rapid processing method and a rapid processing system thereof. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. [0003] Multi-layer boards (Multi-Layer Boards) In order to increase the area that can be wired, multi-layer boards use more single- or double-sided wiring boards. A printed circuit board with one double-sided inner layer and two single-sided outer layers or two double-sided inner layers and two single-sided outer layers is alternately connected through a positioning system and insulating bonding materials, and the conductive pattern The printed circuit boards interconnected according to the design requiremen...
Claims
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Login to View More IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0047H05K3/4611
Inventor 林继生谢占昊罗善文陈媛
Owner SHENNAN CIRCUITS