Manufacturing method of multi-layer flexible circuit board with inner layer needing to be mounted

Abstract

The invention provides a manufacturing method of a multi-layer flexible circuit board with an inner layer needing surface mounting. The manufacturing method comprises the following steps: step 1, manufacturing an inner-layer flexible board needing surface mounting; 2, manufacturing an outer-layer flexible board matched with the mounting position; 3, pressing and curing the first outer-layer flexible plate, the inner-layer flexible plate and the second outer-layer flexible plate to obtain a semi-finished product; step 4, drilling the semi-finished product; 5, metalizing the inside of the hole and the surface of the semi-finished product; 6, selective copper plating is conducted on the part, needing local copper layer thickening, of the semi-finished product; 7, removing the metallized substance at the surface-mounted part, and completing an outer-layer circuit of a semi-finished product; and step 8, laminating cover films on the upper surface and the lower surface of the semi-finished product to obtain the multilayer flexible circuit board of which the inner layer needs to be laminated. The method has the advantages that the distance between the outer-layer circuit and the inner-layer circuit needing to be mounted is reduced, the inner-layer circuit needing to be mounted does not need to be protected, and the engineering design capacity, the production efficiency and the product quality yield are improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a multilayer flexible circuit board whose inner layers need to be mounted. Background technique [0002] The current industry generally uses adhesive tape as a protective layer for the production process of multi-layer flexible circuit boards that need to be mounted on the inner layer to protect the pads, fingers, and leads that need to be mounted on the inner layer. The area of ​​the protective layer is large, the production efficiency is low, and the quality yield rate is low. As electronic products become more and more refined, the surface mount area of ​​the inner layer is getting smaller and more in quantity. This manufacturing process cannot meet the product design and quality yield rate. Contents of the invention [0003] The invention provides a method for manufacturing a multi-layer flexible circuit board whose inner layer needs to be...

AI Technical Summary

Problems solved by technology

[0002] The current industry generally uses adhesive tape as a protective layer for the production process of multi-layer flexible circuit boards that need to be mounted on the inner layer to protect the pads, fingers, and leads that need to be mounted on the inner layer. The area of ​​the protective layer is large, the production efficiency is low, and the quality yield is low

As electronic products become more and more refined, the surface mount area of ​​the inner layer is getting smaller and more in quantity. This manufacturing process cannot meet the product design and quality yield rate.

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