High-temperature-resistant antioxidant soldering tin material

A solder material, high temperature resistant technology, applied in welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of polluting electronic products, affecting the health of employees, quality problems, etc., achieving high use value and avoiding physical damage. Threats, anti-oxidant effect with obvious effect

Pending Publication Date: 2022-03-25
KUNSHAN TIANHE SOLDER MFR
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  • Abstract
  • Description
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Problems solved by technology

[0002] Anti-oxidation alloy technology has been integrated into tin solder for more than 30 years. The treatment of anti-oxidation effect in traditional technology generally adopts the process of removing anti-oxidation oil used in wave soldering assembly, because anti-oxidation oil will pollute the assembly after being exposed to high temperature. There are serious quality problems in electronic products, and during use, anti-oxidation oil will produce smoke sublimation under the high temperature of liquid tin alloy, which will seriously affect the health of employees. In order to solve the above problems, the present invention discloses a high temperature resistant Oxidizing solder material for use in

Method used

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Embodiment

[0018] A high-temperature-resistant and anti-oxidation solder material, based on the total weight of 1000g of the high-temperature-resistant lead-free solder material, the high-temperature-resistant lead-free solder material includes 350-400g of tin-phosphorus anti-oxidation alloy; 50-80g of metal gallium; 0.5g of metal indium -0.8g; the balance is pure tin.

[0019] In this embodiment, the total weight of the tin-phosphorus anti-oxidation alloy is 100g. The tin-phosphorus anti-oxidation alloy includes: 94g of pure tin and 6g of red phosphorus. During the preparation process of the tin-phosphorus anti-oxidation alloy, the red phosphorus Sink into the suction liquid in the cylinder to smelt it and synthesize it with tin.

[0020] Preferably, the amount of tin-phosphorus oxidation-resistant alloy used in preparing the high-temperature-resistant lead-free solder material is 350 g.

[0021] Preferably, the gallium metal used in the preparation of the high temperature resistant le...

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PUM

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Abstract

The invention discloses a high-temperature-resistant anti-oxidation soldering tin material which comprises 350-400 g of tin-phosphorus anti-oxidation alloy, 300-500 g of tin-phosphorus anti-oxidation alloy, 300-500 g of tin-phosphorus anti-oxidation alloy, 300-500 g of tin-phosphorus anti-oxidation alloy, 300-500 g of tin-phosphorus anti-oxidation alloy, 300-500 g of 50 to 80 g of metal gallium; 0.5 to 0.8 g of metal indium; the high-temperature-resistant anti-oxidation soldering tin material disclosed by the invention can replace a traditional anti-oxidation oil process used for removing wave soldering assembly, so that the body of an employee can be prevented from being threatened, the quality problem of a product cannot be caused, and the high-temperature-resistant anti-oxidation soldering tin material is relatively obvious in anti-oxidation effect in a high-temperature state and has relatively high use value.

Description

technical field [0001] The invention relates to the technical field of solder materials, in particular to a high-temperature resistant and oxidation-resistant solder material. Background technique [0002] Anti-oxidation alloy technology has been integrated into tin solder for more than 30 years. In traditional technology, the anti-oxidation effect is generally treated by removing the anti-oxidation oil used in wave soldering assembly, because the anti-oxidation oil will pollute the assembly after being exposed to high temperature. There are serious quality problems in electronic products, and during use, anti-oxidation oil will produce smoke sublimation under the high temperature of liquid tin alloy, which will seriously affect the health of employees. In order to solve the above problems, the present invention discloses a high temperature resistant Oxidizing solder materials are available for use. Contents of the invention [0003] Purpose of the invention: In order to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/26
CPCB23K35/0222B23K35/262
Inventor 陆晓明
Owner KUNSHAN TIANHE SOLDER MFR
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