Substrate, camera module and electronic equipment

Abstract

The embodiment of the invention provides a substrate, a camera module and electronic equipment. The substrate comprises a heat dissipation piece, a supporting plate, a first metal layer, a first base material film and a second metal layer, the surface, deviating from the first base material film, of the first metal layer is provided with a heat dissipation area used for placing a functional device, the heat dissipation area is provided with a plurality of heat dissipation holes at intervals, and the heat dissipation holes extend towards the first base material film; a first groove is formed in the position, opposite to the heat dissipation area, of the surface, away from the first base material film, of the second metal layer, the supporting plate covers the surface, away from the first base material film, of the second metal layer, and a containing cavity is formed by the supporting plate and the first groove; the heat dissipation piece is placed in the containing cavity. Heat generated by the functional device is transmitted to the heat dissipation piece through the heat dissipation holes so that the heat dissipation piece can dissipate the heat.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a substrate, a camera module and electronic equipment. Background technique [0002] With the advancement of technology, the functions of electronic equipment are becoming more and more complete. Electronic devices are usually equipped with a camera module to facilitate users to capture images and videos. In order to improve the imaging effect, an anti-shake function is added to the camera module of the current electronic equipment. The anti-shake methods include optical anti-shake, electronic anti-shake, and pan-tilt anti-shake. Among them, pan-tilt anti-shake is widely used. [0003] For the camera module of the pan-tilt anti-shake, the camera is usually suspended and installed on the pan-tilt bracket, and the camera is driven to move relative to the pan-tilt bracket through the driving mechanism to achieve the purpose of pan-tilt anti-shake. The circui...

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Problems solved by technology

[0005] The embodiment of the present application provides a substrate, a camera module, and electronic equipment to solve the technical problem in the related art that the heat dissipation effect of the circuit substrate in the camera module is poor, making it difficult to dissipate the heat generated by the image sensor

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