Polyurethane AB encapsulating material and production process thereof

A potting material and production process technology, applied in the direction of polyurea/polyurethane adhesive, adhesive type, adhesive, etc., can solve the problem of limited resistance effect, unfavorable strengthening of the integrity of electronic devices, low impact strength of devices, etc. problems, to achieve the effect of strengthening integrity, improving performance and stabilizing parameters, and improving waterproofing

Pending Publication Date: 2022-04-01
石家庄银河微波技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a polyurethane AB potting material and its production process, in order to solve the above-mentioned problems in the current market when the components are potted, the potting is mainly carried out thro

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0020] Example 1:

[0021] A kind of polyurethane AB potting material and its production process, the following is a detailed introduction to the above production and its application:

[0022] (1) Selection of materials: Prepare polyurethane A material and polyurethane B material in a ratio of 35.5:100.

[0023] (2) Preparations: Check that the devices and products to be potted should be kept dry and clean.

[0024] (3) Preheating: After setting the appropriate temperature and duration of the oven, place the devices that need to be potted in the oven for pre-baking work.

[0025] (4) Mixing: Mix the pre-prepared material of polyurethane A and material of polyurethane B, and place them in a stirring device for stirring after mixing. Keep the stirring rod vertical during stirring, and stir clockwise for 2 minutes. During the process, the stirring of air should be minimized, and attention should be paid to stirring evenly at the bottom and edge of the container to avoid incompl...

Example Embodiment

[0034] Embodiment 2:

[0035] A kind of polyurethane AB potting material and its production process, the following is a detailed introduction to the above production and its application:

[0036] (1) Selection of materials: Prepare polyurethane A material and polyurethane B material in a ratio of 35.5:100.

[0037] (2) Preparations: Check that the devices and products to be potted should be kept dry and clean.

[0038] (3) Preheating: After setting the appropriate temperature and duration of the oven, place the devices that need to be potted in the oven for pre-baking work.

[0039] (4) Mixing: Mix the pre-prepared material of polyurethane A and material of polyurethane B, and place them in a stirring device for stirring after mixing. Keep the stirring bar vertical during stirring, and stir clockwise for 3 minutes. During the process, the stirring of air should be minimized, and attention should be paid to stirring evenly at the bottom and edge of the container to avoid inco...

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PUM

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Abstract

The invention discloses a polyurethane AB encapsulating material and a production process thereof. The production process comprises the following steps: (1) selecting materials: respectively preparing a polyurethane A material and a polyurethane B material according to a ratio of 35.5: 100; (2) preparation: checking a device to be encapsulated, wherein a product needs to be kept dry and clean; and (3) preheating: setting proper temperature and duration of the drying oven, and then placing the device needing to be encapsulated in the drying oven for pre-drying work. According to the polyurethane AB potting material and the production process thereof, the mixture obtained by mixing polyurethane AB is used for potting, so that the integrity of an electronic device is enhanced, the resistance to external impact and vibration is improved, and the positive effect is achieved in the aspect of improving the insulation between internal elements and circuits, so that the miniaturization and the light weight of the device are facilitated, and the production cost is reduced. The direct exposure of elements and circuits is avoided, the waterproof and moisture-proof performance of the device is improved, and the use performance and stable parameters are further improved.

Description

technical field [0001] The invention relates to the technical field of potting, in particular to a polyurethane AB potting material and a production process thereof. Background technique [0002] Potting is to pour the liquid compound into the device equipped with electronic components and circuits by mechanical or manual means, and solidify it into a thermosetting polymer insulating material with excellent performance under normal temperature or heating conditions, which is used for bonding electronic components. Sealing, potting and coating protection. [0003] When potting components in the market today, silicone rubber is mainly used for potting, and devices potted with silicone rubber materials have low impact strength, which is not conducive to maximizing the integrity of electronic devices, making them vulnerable to external The resistance effect of shock and vibration is limited. Therefore, we propose a method for conveniently solving the above problems from the pro...

Claims

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Application Information

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IPC IPC(8): C09J175/04
Inventor 彭官忠王永赵广雷赵松果
Owner 石家庄银河微波技术股份有限公司
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