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Polyurethane AB encapsulating material and production process thereof

A potting material and production process technology, applied in the direction of polyurea/polyurethane adhesive, adhesive type, adhesive, etc., can solve the problem of limited resistance effect, unfavorable strengthening of the integrity of electronic devices, low impact strength of devices, etc. problems, to achieve the effect of strengthening integrity, improving performance and stabilizing parameters, and improving waterproofing

Pending Publication Date: 2022-04-01
石家庄银河微波技术股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a polyurethane AB potting material and its production process, in order to solve the above-mentioned problems in the current market when the components are potted, the potting is mainly carried out through silicone rubber, and the silicone rubber material is used for potting. The impact strength of potted devices is low, which is not conducive to maximizing the integrity of electronic devices, making the resistance to external shocks and vibrations limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A polyurethane AB potting material and its production process, the above-mentioned production and its application are introduced in detail below:

[0022] (1) Selected materials: Prepare polyurethane A material and polyurethane B material respectively according to the ratio of 35.5:100.

[0023] (2) Preparatory work: Check the devices and products to be potted and keep them dry and clean.

[0024] (3) Preheating: After setting the appropriate temperature and time in the oven, place the device to be potted in the oven for pre-baking.

[0025] (4) Mixing: Mix the pre-prepared materials according to polyurethane A and materials according to polyurethane B, and place them in a stirring device for stirring after mixing. When stirring, keep the stirring rod vertical and stir clockwise for 2 minutes. During the process, the air should be minimized, and the bottom and edge of the container should be stirred evenly to avoid incomplete curing. After the stirring is completed, th...

Embodiment 2

[0035] A polyurethane AB potting material and its production process, the above-mentioned production and its application are introduced in detail below:

[0036] (1) Selected materials: Prepare polyurethane A material and polyurethane B material respectively according to the ratio of 35.5:100.

[0037] (2) Preparatory work: Check the devices and products to be potted and keep them dry and clean.

[0038] (3) Preheating: After setting the appropriate temperature and time in the oven, place the device to be potted in the oven for pre-baking.

[0039] (4) Mixing: Mix the pre-prepared materials according to polyurethane A and materials according to polyurethane B, and place them in a stirring device for stirring after mixing. When stirring, keep the stirring rod vertically and stir clockwise for 3 minutes. During the process, the air should be minimized, and the bottom and edge of the container should be stirred evenly to avoid incomplete curing. After the stirring is completed, ...

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Abstract

The invention discloses a polyurethane AB encapsulating material and a production process thereof. The production process comprises the following steps: (1) selecting materials: respectively preparing a polyurethane A material and a polyurethane B material according to a ratio of 35.5: 100; (2) preparation: checking a device to be encapsulated, wherein a product needs to be kept dry and clean; and (3) preheating: setting proper temperature and duration of the drying oven, and then placing the device needing to be encapsulated in the drying oven for pre-drying work. According to the polyurethane AB potting material and the production process thereof, the mixture obtained by mixing polyurethane AB is used for potting, so that the integrity of an electronic device is enhanced, the resistance to external impact and vibration is improved, and the positive effect is achieved in the aspect of improving the insulation between internal elements and circuits, so that the miniaturization and the light weight of the device are facilitated, and the production cost is reduced. The direct exposure of elements and circuits is avoided, the waterproof and moisture-proof performance of the device is improved, and the use performance and stable parameters are further improved.

Description

technical field [0001] The invention relates to the technical field of potting, in particular to a polyurethane AB potting material and a production process thereof. Background technique [0002] Potting is to pour the liquid compound into the device equipped with electronic components and circuits by mechanical or manual means, and solidify it into a thermosetting polymer insulating material with excellent performance under normal temperature or heating conditions, which is used for bonding electronic components. Sealing, potting and coating protection. [0003] When potting components in the market today, silicone rubber is mainly used for potting, and devices potted with silicone rubber materials have low impact strength, which is not conducive to maximizing the integrity of electronic devices, making them vulnerable to external The resistance effect of shock and vibration is limited. Therefore, we propose a method for conveniently solving the above problems from the pro...

Claims

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Application Information

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IPC IPC(8): C09J175/04
Inventor 彭官忠王永赵广雷赵松果
Owner 石家庄银河微波技术股份有限公司
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