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Electronic component with metal cap

A technology of electronic components and metal caps, which is applied in the field of component packaging around electronic chips, and can solve problems affecting chip frequency resonance and other issues

Pending Publication Date: 2022-04-08
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Protective package may resonate at frequencies affecting chip operation

Method used

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  • Electronic component with metal cap
  • Electronic component with metal cap
  • Electronic component with metal cap

Examples

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Embodiment Construction

[0016] The present disclosure describes an electronic component that includes a package having a top side and a bottom side and at least one electronic chip housed within a housing inside the package. The package includes a package base on its top side. The package base includes a chip mounting element with at least one electronic chip attached therein. The package also includes a metal cap on its bottom side. At least one electronic chip is separated from the metal cap by a gap, and the metal cap is attached to the package base to form the housing.

[0017] In the drawings of the present disclosure, the plane defined by the x-axis and the y-axis is parallel to the plane of the circuit board to which the electronic component will be attached. The direction defined by the z-axis is perpendicular to the same board plane and is perpendicular to the bottom surface of the metal cap.

[0018] The words "bottom" and "top" here simply refer to how the components are placed on the b...

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PUM

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Abstract

The invention relates to an electronic component with a metal cap. The present disclosure describes an electronic component including a package having a top side and a bottom side, and at least one electronic chip housed within a housing inside the package. The package includes a package base on a top side thereof and a metal cap on a bottom side thereof. The at least one electronic chip is separated from the metal cap by a gap, and the metal cap is attached to the package base to form a housing.

Description

technical field [0001] The present invention relates to electronic components, in particular the packaging of components around electronic chips. The present disclosure also relates to electronic components in which the component package includes a base and a cap attached to the base. Background technique [0002] Electronic chips, which may also be referred to as dies, are typically prepared by fabricating various electronic structures on a substrate and dicing the substrate into chip-sized pieces. Each chip can then be placed inside a protective encapsulation that forms an enclosure in which the chip is protected from the surrounding environment. The chip may be mechanically attached to a support structure inside the housing, such as a die pad, and electrically connected to contacts extending outside the housing. The packaged chip thus forms an electronic component that can be mounted on a circuit board. [0003] The protective package may include a package base having ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/053H01L23/06H01L23/10H01L23/14H01L23/488H05K1/18
CPCH01L23/06H01L23/10H01L2224/48227H01L2924/16251H05K1/111H05K3/305H05K3/3426H05K2201/2045Y02P70/50H01L23/043H01L23/13H01L23/49838H01L23/49872H05K3/4007H05K3/40
Inventor 基莫·凯亚
Owner MURATA MFG CO LTD