Support plate manufacturing method, support plate and semiconductor packaging method
A manufacturing method and carrier board technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, etc., can solve the problems that the positioning device cannot be placed, and the utilization rate of the carrier board is affected, so as to improve the recognition degree Effect
Pending Publication Date: 2022-04-12
SIPLP MICROELECTRONICS CHONGQING CO LTD
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However, in the related art, during the placement process, there is a situation that the placement device cannot recognize some positioning devices, resulting in the inability to place placement at these positioning devices, which affects the utilization rate of the carrier board
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[0040] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.
[0041] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. Unless otherwise defined, the technical terms or scientific terms used in the application shall have the ordinary meanings understood by those skilled in the art to which the application belongs. Words such as "one" or "one" used in ...
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Abstract
The invention provides a manufacturing method of a carrier plate, the carrier plate and a semiconductor packaging method. The manufacturing method of the carrier plate comprises the following steps: providing a plate body; grinding the surface of the plate body to form a grinding surface; positioning holes are formed in the grinding face according to preset positions, the grinding face is processed to improve the contrast ratio between the positioning holes and the grinding face outside the positioning holes, and the carrier plate with the positioning holes is formed. According to the embodiment, the grinding surface is processed to improve the contrast ratio between the positioning hole and the outer grinding surface of the positioning hole, so that the recognition degree of the positioning hole is improved, the positioning accuracy is improved, and the utilization rate of the carrier plate is improved.
Description
technical field [0001] The present application relates to the technical field of semiconductors, and in particular to a manufacturing method of a carrier, a carrier and a semiconductor packaging method. Background technique [0002] In the semiconductor packaging process, it is usually necessary to mount a chip on a carrier so as to plastic-encapsulate the mounted die. When implementing placement, a positioning device is usually provided on the carrier to facilitate identification by the placement device, and the die is attached to a position corresponding to the positioning device. However, in the related art, during the placement process, there is a situation that the placement device cannot recognize some positioning devices, resulting in the inability to place placement at these positioning devices, which affects the utilization rate of the carrier board. Contents of the invention [0003] One aspect of the present application provides a method for manufacturing a car...
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IPC IPC(8): H01L21/48H01L23/544H01L21/50H01L21/56
Inventor 穆正德刘景宽
Owner SIPLP MICROELECTRONICS CHONGQING CO LTD