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Label taking mechanism for chip heat dissipation stickers

A chip heat dissipation and header technology, which is applied to the field of the labeling mechanism of chip heat dissipation stickers, can solve problems such as poor generality of headers, and achieve the effects of solving air bubbles, facilitating discharge, and improving applicability

Active Publication Date: 2022-04-15
CHIPMORE TECH CORP LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the size setting of the headers in the prior art is fixed, and one header corresponds to a heat dissipation sticker of a size, so that a device needs to be equipped with multiple sizes of headers, resulting in the difficulty of getting the headers. poor versatility

Method used

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  • Label taking mechanism for chip heat dissipation stickers
  • Label taking mechanism for chip heat dissipation stickers
  • Label taking mechanism for chip heat dissipation stickers

Examples

Experimental program
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Effect test

Embodiment Construction

[0048] The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0049] Embodiments of the present invention: as Figure 1-16 As shown, a labeling mechanism for chip heat dissipation stickers is disclosed. The labeling mechanism for heat dissipation stickers can absorb heat dissipation stickers under the action of vacuum adsorption holes and transfer the heat dissipation stickers to the position of the flexible substrate, and then dissipate heat dissipation. attached to a flexible substrate.

[0050] In the specific embodiment, the label-taking mechanism for the chip cooling paste includes a bracket 1, a header assembly 2 arranged on the bracket 1, an adjustment assembly 3 and a height adjustment member 4, and the header assembly 2 includes a middle The header 21 and the side header 22 arranged on the side of the middle header 21, the middle header 21 and...

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Abstract

The label taking mechanism comprises a support, a label head assembly, an adjusting assembly and a height adjusting part, the label head assembly, the adjusting assembly and the height adjusting part are arranged on the support, the label head assembly comprises a middle label head and side label heads arranged on the two opposite sides of the middle label head, and the middle label head and the two side label heads are arranged in parallel in the transverse direction; the adjusting assembly is matched with the side header to drive the side header to be close to or away from the middle header in the transverse direction; the height adjusting piece drives the middle header to move in the vertical direction. Concave spaces are formed in the bottoms of the middle header and the side headers, and vacuum adsorption holes are formed in the concave spaces. According to the embodiment of the invention, the label taking mechanism can be suitable for heat dissipation stickers with various sizes, and the bottom of the label taking mechanism is provided with the recess which is matched with the heat dissipation sticker in size, so that bubbles can be conveniently discharged in the process of adhering the heat dissipation sticker to the flexible substrate, and the generation of the bubbles after the heat dissipation sticker is adhered is effectively solved.

Description

technical field [0001] The invention relates to the technical field of labeling, in particular to a label-taking mechanism for chip cooling stickers. Background technique [0002] During the packaging process of the chip, a heat dissipation sticker needs to be pasted on the back of the chip to facilitate the heat dissipation of the chip. In the prior art, a heat dissipation sticker machine is generally used to paste the heat dissipation sticker. Taking the header as the handle for the transfer of heat dissipation stickers plays an important role in the process of pasting heat dissipation stickers. In the prior art, the bottom of the header is generally arranged in a planar structure, and a number of vacuum adsorption holes are formed on the bottom of the header, and the heat dissipation sticker is adsorbed by using the vacuum adsorption holes. In the actual use process, after the heat dissipation sticker is pasted, air bubbles will easily form between the heat dissipation s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
CPCH01L21/67742Y02P70/10
Inventor 杨曙欣
Owner CHIPMORE TECH CORP LTD
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