Coaxial light source seat

Abstract

The coaxial light source base comprises a coaxial light source base body with a through hole formed in the top, a light reflecting cubic assembly, a light source reflecting assembly and a point light source, the light reflecting cubic assembly is installed in the through hole, a light inlet hole is formed in the side wall of the coaxial light source base body, and the light source reflecting assembly is fixed to the side wall where the light inlet hole is located; the point light source is fixed on the light source reflection assembly, so that the point light source emits a light source, and the light source enters the reflection cube assembly from the light inlet hole through the light source reflection assembly and then is emitted out from the through hole of the reflection cube assembly. Light sources are emitted through the light source reflection assembly and the light reflection cube assembly, the light sources are evenly distributed in the light path propagation process, and the first interval and the second interval are arranged in the cube fixing base, so that the light reflection cube can be limited, and the cube light reflection face can be prevented from being scratched. The pins are used for positioning, and the set screws are used for fixing, so that the cubic fixing seat and the coaxial light source base main body can be fixed without loosening.

Description

technical field [0001] The invention relates to the technical field of industrial cameras, in particular to a coaxial light source seat. Background technique [0002] During wafer laser hidden cutting, wafer low-k film grooving and wafer SDBG processing, it is necessary to calibrate the wafer posture and the position of the dicing line. The size of the grains in different batches of wafers is different, and it is necessary to Switch the vision of different magnifications to the initial positioning and secondary positioning of the marking point; the low-magnification camera locates the wafer, and the MARK point of the wafer is to be found, the image matches the wafer template, and the MARK point of the template is compared with the actual camera to find the MARK point Position, adjust the wafer attitude, find the center of the wafer, and then use the low-magnification camera to find the approximate position of the die template, switch to the high-magnification camera to accur...

AI Technical Summary

Problems solved by technology

[0003]In the process of wafer hidden cutting, it is necessary to locate the position of the wafer. In the actual production process, two sets of vision systems with different magnifications are required. Two sets of The physical installation distance of the camera may cause errors, and the visual coordinate system transformation is required during the positioning process, which increases the instability of the program operation

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