Radio frequency antenna manufacturing method and radio frequency antenna

Abstract

The invention relates to the technical field of antenna manufacturing, in particular to a method for manufacturing a radio frequency antenna and a radio frequency antenna. By implanting an enameled coil on a substrate according to a target shape, and then removing the insulating layer of the lead part by milling or grinding, the lead wire is exposed. Then drop a conductive medium onto the packaged conductive material to form a conductive coil, and press the conductive coil to the target area where the conductor of the lead part is located to form a structure that is electrically connected to the conductor, and let the conductor and the conductive medium The finished product of the radio frequency antenna with the layers integrally formed and electrically connected, so that the present invention no longer needs to use the touch welding method to remove the insulating layer on the enameled coil in the process of making the radio frequency antenna as in the prior art, which solves the problem of the prior art. When the insulating layer on the enameled coil is removed by the butt welding method, the base material is welded through due to the large number of solder joints, resulting in low efficiency and technical defects affecting the yield.

Description

technical field [0001] The invention relates to the technical field of antenna manufacturing, in particular to a manufacturing method of a radio frequency antenna and a radio frequency antenna. Background technique [0002] At present, different types of smart cards with different functions are widely used in various fields. [0003] The antenna is the main structure of the material in the smart card. [0004] In the prior art, the production process of the smart card is as follows: [0005] Carry out punching of base material positioning holes and conductive sheet hole avoidance holes → place the non-metallic base material on the working table of the ultrasonic wire embedding machine, and use the above positioning holes to position the material, and at the same time determine the position of the embedding wire and the avoidance of the wire head crossing. Empty hole position→Attach tape on the position where the buried non-metallic substrate crosses the empty hole of the c...

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to provide a radio frequency antenna manufacturing method and radio frequency antenna, aiming to solve the problem that the welding process of the prior art adopts the welding process to manufacture the smart card, which causes the base material to be easily welded through due to the large number of solder joints, thereby resulting in production efficiency. Technical issues with low and high defect rates

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