The invention discloses an integrated conformal manufacturing method of a multilayer interconnected three-dimensional circuit and a product, and belongs to the field of multilayer antenna manufacturing. The method comprises the steps of S1, preparing a supporting structure base body in a 3D printing mode; S2, preparing an activation pattern with catalytic capability on the surface of the supporting structure base body obtained in the step S1; S3, depositing metal on the activation pattern, obtaining a metal pattern layer consistent with the activation pattern, wherein the metal pattern prepared for the first time is a first metal pattern layer; S4, preparing a dielectric layer used for isolating two adjacent metal pattern layers, wherein the dielectric layer prepared for the first time isa first dielectric layer; S5, preparing a vertical interconnection through hole penetrating through the dielectric layer, wherein the vertical interconnection through hole has conductivity so as to interconnect the two adjacent metal pattern layers; and S6, preparing a second metal pattern layer on the first dielectric layer. The method provided by the invention can realize rapid, high-quality andlow-cost preparation of the multilayer interconnected three-dimensional circuit.