Integrated conformal manufacturing method of multilayer interconnected three-dimensional circuit and product

A technology of three-dimensional circuit and manufacturing method, which is applied in the directions of processing and manufacturing, radiation element structure, additive processing, etc., to achieve high integration, improve design freedom, and improve the effect of integration

Active Publication Date: 2020-09-01
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of jet printing in the preparation of conformal circuits have been mentioned above
[0012] To sum up, the existing technology is facing great challenges in the realization of multi-layer vertically interconnected conformal antenna and circuit in

Method used

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  • Integrated conformal manufacturing method of multilayer interconnected three-dimensional circuit and product

Examples

Experimental program
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Effect test

Embodiment 1

[0075] Example 1: Preparation method of PEEK-based conformal antenna

[0076] (1) Use Fused Deposition (FDM) equipment to print the PEEK antenna support structure base. The raw material of PEEK is wire with a diameter of 1.75mm, the printing temperature is 380-430℃, the printing line speed is 80-120mm / s, and the support structure base needs 100%. filling. The support structure matrix has a tensile strength of 95MPa or more, a flexural strength of 140MPa or more, a tensile modulus of 4GPa, and a flexural modulus of 3.7GPa. The thickness of the support structure base is 3mm, and the projected area diameter of the electronic component is more than 200mm.

[0077] (2) Prepare a feed hole with a diameter of 300μm on the PEEK support structure matrix by laser drilling, use a scanner to reduce the surface roughness of the dielectric layer to Sa=3.2μm, and use a microetching solution to integrate the dielectric structure deal with. The composition of the micro-etching solution is: water...

Embodiment 2

[0085] Embodiment 2: Preparation method of aluminum alloy cold plate base antenna

[0086] (1) Using laser selective melting (SLM) method to prepare curved cold plates according to the design, aluminum alloy material 2A21, cold plate inner runner diameter 3mm, plate thickness 5mm.

[0087] (2) Use a micropen system to prepare an insulating medium layer on the surface of the cold plate. The material is a thermosetting polyimide solution. The polyimide solution is irradiated with an infrared lamp and cured under a temperature gradient below 180°C.

[0088] (3) Microetch the surface of the polyimide dielectric layer, and then prepare a solid film containing palladium ions on the surface.

[0089] (4) A 1064nm nanosecond laser is used to scan according to a preset path. The laser parameters are pulse width 10ns, repetition frequency 50KHz, scanning speed 1500-2000mm / s, laser peak power 30w, and palladium-containing ions are selectively activated on the surface of the curved polyimide laye...

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Abstract

The invention discloses an integrated conformal manufacturing method of a multilayer interconnected three-dimensional circuit and a product, and belongs to the field of multilayer antenna manufacturing. The method comprises the steps of S1, preparing a supporting structure base body in a 3D printing mode; S2, preparing an activation pattern with catalytic capability on the surface of the supporting structure base body obtained in the step S1; S3, depositing metal on the activation pattern, obtaining a metal pattern layer consistent with the activation pattern, wherein the metal pattern prepared for the first time is a first metal pattern layer; S4, preparing a dielectric layer used for isolating two adjacent metal pattern layers, wherein the dielectric layer prepared for the first time isa first dielectric layer; S5, preparing a vertical interconnection through hole penetrating through the dielectric layer, wherein the vertical interconnection through hole has conductivity so as to interconnect the two adjacent metal pattern layers; and S6, preparing a second metal pattern layer on the first dielectric layer. The method provided by the invention can realize rapid, high-quality andlow-cost preparation of the multilayer interconnected three-dimensional circuit.

Description

Technical field [0001] The invention belongs to the field of multilayer antenna manufacturing, and more specifically, relates to an integrated conformal manufacturing method and product of a multilayer interconnected three-dimensional circuit. Background technique [0002] Curved surface electronic conformal manufacturing technology refers to the preparation of a circuit that depends on the shape of the substrate on a curved dielectric substrate (polymer, ceramic, glass and other materials). It is a key technology for integrating antennas and sensors. It is used in flexible manufacturing, intelligent manufacturing, and aviation. There are a wide range of applications in aerospace and other fields, such as touch screens in the consumer electronics field, civilian curved wearable devices, and conformal antennas in the defense field. [0003] The integrated manufacturing technology of conformal circuits can maximize the weight reduction, miniaturization, integration, and cross-scale c...

Claims

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Application Information

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IPC IPC(8): H01Q1/38B29C64/10B33Y10/00
CPCB33Y10/00B29C64/10H01Q1/38
Inventor 曾晓雁欧阳韬源吴烈鑫吕铭王月月凌怡辰
Owner HUAZHONG UNIV OF SCI & TECH
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