Integrated conformal manufacturing method of multilayer interconnected three-dimensional circuit and product

Abstract

The invention discloses an integrated conformal manufacturing method of a multilayer interconnected three-dimensional circuit and a product, and belongs to the field of multilayer antenna manufacturing. The method comprises the steps of S1, preparing a supporting structure base body in a 3D printing mode; S2, preparing an activation pattern with catalytic capability on the surface of the supporting structure base body obtained in the step S1; S3, depositing metal on the activation pattern, obtaining a metal pattern layer consistent with the activation pattern, wherein the metal pattern prepared for the first time is a first metal pattern layer; S4, preparing a dielectric layer used for isolating two adjacent metal pattern layers, wherein the dielectric layer prepared for the first time isa first dielectric layer; S5, preparing a vertical interconnection through hole penetrating through the dielectric layer, wherein the vertical interconnection through hole has conductivity so as to interconnect the two adjacent metal pattern layers; and S6, preparing a second metal pattern layer on the first dielectric layer. The method provided by the invention can realize rapid, high-quality andlow-cost preparation of the multilayer interconnected three-dimensional circuit.

Description

Technical field [0001] The invention belongs to the field of multilayer antenna manufacturing, and more specifically, relates to an integrated conformal manufacturing method and product of a multilayer interconnected three-dimensional circuit. Background technique [0002] Curved surface electronic conformal manufacturing technology refers to the preparation of a circuit that depends on the shape of the substrate on a curved dielectric substrate (polymer, ceramic, glass and other materials). It is a key technology for integrating antennas and sensors. It is used in flexible manufacturing, intelligent manufacturing, and aviation. There are a wide range of applications in aerospace and other fields, such as touch screens in the consumer electronics field, civilian curved wearable devices, and conformal antennas in the defense field. [0003] The integrated manufacturing technology of conformal circuits can maximize the weight reduction, miniaturization, integration, and cross-scale c...

AI Technical Summary

Problems solved by technology

However, the disadvantages of jet printing in the preparation of conformal circuits have been mentioned above

[0012] To sum up, the existing technology is facing great challenges in the realization of multi-layer vertically interconnected conformal antenna and circuit integrated fast manufacturing. Therefore, it is necessary to develop a new manufacturing method for multi-layer interconnected circuit structure, which can High-quality and low-cost preparation of curved surface single-layer / multi-layer dielectric interconnection circuits

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