Method for realizing interconnection between microwave signal boards and interconnected microwave signal board

Abstract

The invention relates to the field of active phased arrays, and discloses a method for realizing interconnection between microwave signal boards and an interconnected microwave signal board. The interlayer adapter board is provided with a limit hole for limiting the spring connection structure; a separable spring connection structure is arranged between the adjacent upper and lower composite substrates to connect all the The spring connection structure is arranged in the limit hole, and metal pads are arranged at the positions of the adjacent upper and lower composite substrates corresponding to the spring connection structure; the adjacent upper and lower composite substrates are squeezed, and the The spring connection structure is in contact with the metal pads on the upper and lower composite substrates to realize interconnection; after the interconnection is completed, a high and low frequency mixed joint assembly for external connection is arranged on the upper composite substrate. The present invention can realize the vertical interconnection between boards of more than 10 mm, and has high expansibility.

Description

technical field [0001] The invention relates to the field of active phased arrays, in particular to a method for realizing interconnection between microwave signal boards and an interconnected microwave signal board. Background technique [0002] There are many methods for inter-board interconnection of microwave signals, and there are mainly two traditional methods: [0003] The first is to use the RF connector SMP or SMPM plus a transition adapter KK to realize the transition between the composite substrate 1 and the composite substrate 2. The disadvantage of this method is that there is an insertion between the transition adapter KK and the RF connector SMPM. Pulling torque, when more than 100 sets of connection structures are plugged and pulled between the boards at the same time, there will be a large torque, which will make it difficult to pull out and insert, and the composite substrate will be twisted and deformed, and even damage the devices carried on the substrate...

AI Technical Summary

Problems solved by technology

The advantage of this method is that the frequency of signal transmission is high and the vibration resistance is large, but it also has three disadvantages: the relative distance between the upper composite substrate and the lower composite substrate exceeds 10mm, and multiple sets of fur buttons are required to be connected in series to achieve long-distance transmission. , there are reliability problems; the protruding length of the fur button thimble is related to the compression of the fur button, generally within 10% (the maximum stretching length of the thimble is 0.5mm), which cannot meet the demand for greater elastic expansion; the fur button is integrated in the metal frame In the medium body, if there are too many fur buttons integrated in a frame, some or some of the fur buttons are damaged, and the entire frame needs to be removed for repair and replacement

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