Method for realizing interconnection between microwave signal boards and interconnected microwave signal boards

Abstract

The invention relates to the field of active phased arrays, and discloses a method for realizing interconnection between a microwave signal board and an interconnected microwave signal board. The method comprises the following steps: arranging an interlayer adapter board for supporting a composite substrate at a middle position between an upper composite substrate and a lower composite substrate which are adjacent to each other, and forming a limiting hole for limiting the spring connecting structure in the interlayer adapter board; arranging a separable spring connecting structure between the adjacent upper and lower composite substrates, arranging the spring connecting structure in the limiting hole, and arranging metal bonding pads at the positions, corresponding to the spring connecting structure, of the adjacent upper and lower composite substrates; extruding the adjacent upper and lower composite substrates, and enabling the spring connecting structures to be in contact with the metal bonding pads on the upper and lower composite substrates to realize interconnection; and after interconnection is completed, arranging a high and low frequency mixed joint assembly used for external connection on the upper composite substrate. According to the invention, longitudinal interconnection between boards of 10 mm or above can be realized, and the expansibility is high.

Description

technical field [0001] The invention relates to the field of active phased arrays, in particular to a method for realizing interconnection between microwave signal boards and an interconnected microwave signal board. Background technique [0002] There are many methods for inter-board interconnection of microwave signals, and there are mainly two traditional methods: [0003] The first is to use the RF connector SMP or SMPM plus a transition adapter KK to realize the transition between the composite substrate 1 and the composite substrate 2. The disadvantage of this method is that there is an insertion between the transition adapter KK and the RF connector SMPM. Pulling torque, when more than 100 sets of connection structures are plugged and pulled between the boards at the same time, there will be a large torque, which will make it difficult to pull out and insert, and the composite substrate will be twisted and deformed, and even damage the devices carried on the substrate...

AI Technical Summary

Problems solved by technology

The advantage of this method is that the frequency of signal transmission is high and the vibration resistance is large, but it also has three disadvantages: the relative distance between the upper composite substrate and the lower composite substrate exceeds 10mm, and multiple sets of fur buttons are required to be connected in series to achieve long-distance transmission. , there are reliability problems; the protruding length of the f

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