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An integrated conformal manufacturing method for a multilayer interconnected three-dimensional circuit

A technology of three-dimensional circuit and manufacturing method, which is applied in the direction of processing and manufacturing, radiation element structure, additive processing, etc., to achieve the effect of improving design freedom, promoting intelligent process, and improving integration

Active Publication Date: 2021-10-08
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantages of jet printing in the preparation of conformal circuits have been mentioned above
[0012] To sum up, the existing technology is facing great challenges in the realization of multi-layer vertically interconnected conformal antenna and circuit integrated fast manufacturing. Therefore, it is necessary to develop a new manufacturing method for multi-layer interconnected circuit structure, which can High-quality and low-cost preparation of curved surface single-layer / multi-layer dielectric interconnection circuits

Method used

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  • An integrated conformal manufacturing method for a multilayer interconnected three-dimensional circuit

Examples

Experimental program
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Effect test

Embodiment 1

[0075] Example 1: Preparation method of PEEK-based conformal antenna

[0076] (1) Use fused deposition (FDM) equipment to print the PEEK antenna support structure matrix. The PEEK raw material is a wire material with a diameter of 1.75mm. The printing temperature is 380-430°C, the printing line speed is 80-120mm / s, and the support structure matrix needs to be 100%. filling. The tensile strength of the support structure matrix is ​​above 95MPa, the bending strength is above 140MPa, the tensile modulus is 4GPa, and the bending modulus is 3.7GPa. The thickness of the supporting structure matrix is ​​3 mm, and the diameter of the projected area of ​​the electronic component is more than 200 mm.

[0077] (2) Prepare a feeding hole with a diameter of 300 μm on the PEEK support structure substrate by laser drilling, use a sweeping machine to reduce the surface roughness of the dielectric layer to Sa=3.2 μm, and use a microetching solution to integrate the dielectric structure deal ...

Embodiment 2

[0085] Example 2: Preparation method of aluminum alloy cold plate-based antenna

[0086] (1) The curved surface cold plate is prepared according to the design by laser selective melting (SLM), the aluminum alloy material is 2A21, the inner flow channel diameter of the cold plate is 3 mm, and the plate thickness is 5 mm.

[0087] (2) Prepare an insulating medium layer on the surface of the cold plate by using a micro-pen system. The material is a thermosetting polyimide solution, and the polyimide solution is irradiated with an infrared lamp, and is cured under a temperature gradient below 180°C.

[0088] (3) Microetching the surface of the polyimide dielectric layer, and then preparing a solid film containing palladium ions on the surface.

[0089] (4) Use 1064nm nanosecond laser to scan according to the preset path. The laser parameters are pulse width 10ns, repetition frequency 50KHz, scanning speed 1500-2000mm / s, laser peak power 30w, and selectively activate palladium-con...

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Abstract

The invention discloses an integrated conformal manufacturing method and product of a multi-layer interconnected three-dimensional circuit, belonging to the field of multi-layer antenna manufacturing, comprising: S1 adopting 3D printing to prepare a supporting structure substrate, S2 obtaining the surface of the supporting structure substrate obtained in step S1 Prepare an activation pattern with catalytic ability, S3 deposit metal on the activation pattern to obtain a metal pattern layer consistent with the activation pattern, the metal pattern prepared for the first time is the first metal pattern layer, S4 prepare a dielectric layer, and the dielectric layer is used for the isolation phase Adjacent to two metal pattern layers, the dielectric layer prepared for the first time is the first dielectric layer, S5 prepares a vertical interconnection via hole penetrating the dielectric layer, and the vertical interconnection via hole has conductivity to interconnect two adjacent metal pattern layers, S6 A second metal pattern layer is prepared on the first dielectric layer. The method of the invention can realize rapid, high-quality and low-cost preparation of multi-layer interconnected three-dimensional circuits.

Description

technical field [0001] The invention belongs to the field of multilayer antenna manufacturing, and more specifically relates to an integrated conformal manufacturing method and product of multilayer interconnected three-dimensional circuits. Background technique [0002] Surface electronic conformal manufacturing technology refers to the preparation of circuits on curved dielectric substrates (polymers, ceramics, glass, etc.) that depend on the shape of the substrate. It is a key technology for integrated antennas and sensors. Aerospace and other fields have a wide range of applications, such as touch screens in the field of consumer electronics, wearable devices with curved surfaces for civilian use, and conformal antennas in the field of defense. [0003] The integrated manufacturing technology of conformal circuits can maximize the weight reduction, miniaturization, integration, and cross-scale surfaceization of conformal electronic components (such as conformal antennas)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38B29C64/10B33Y10/00
CPCB33Y10/00B29C64/10H01Q1/38
Inventor 曾晓雁欧阳韬源吴烈鑫吕铭王月月凌怡辰
Owner HUAZHONG UNIV OF SCI & TECH
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