X/Ku wave band broadband frequency conversion assembly based on TSV technology

Abstract

The invention discloses an X / Ku wave band broadband frequency conversion assembly based on a TSV technology. The working frequency band covers 6-18 GHz, the output frequency is 1.3-2.3 GHz, stray and harmonic suppression is smaller than or equal to -50 dBm, and the output dynamic state is 30 dB. The SIP design is realized by adopting a semiconductor-based TSV technology, and then a multi-chip micro-assembly technology is adopted, so that the integration level is improved and the size of the assembly is reduced under the condition that the performance is not reduced.

Description

technical field [0001] The invention belongs to the field of microwave communication, and in particular relates to an X / Ku band broadband frequency conversion component based on TSV technology. Background technique [0002] In recent years, military and aerospace electronic equipment has developed towards "light, thin, and short", and the demand for high-density, high-function, and high-speed circuit components is becoming more and more urgent. The X / Ku-band broadband frequency conversion component is the core part of the microwave receiving front end of a certain vehicle-mounted electronic interference equipment, and its miniaturization design is of great significance. With the continuous development of microwave integrated circuit technology and micro-assembly technology, the miniaturization design of microwave components has also made great progress, and is developing in the direction of broadband, small size, light weight, high performance, and miniaturization. [0003]...

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Problems solved by technology

[0003] In his dissertation "Research on Microwave Broadband Frequency Conversion Components", the author Zhu Chenwei used independently designed multiple MEMS filters and single-pole multi-throw switches to build a switch filter group. The design method is a planar filter. Each filter Both need to use partition walls and adopt micro-assembly assembly, which has the problems of large volume and difficulty in ensuring the consistency of multi-component performance, and cannot meet the existing miniaturization and high-performance requirements

[0004] In the article "2-18GHz ultra-broadband miniaturization down-conversion channel design" published by Li Zhen in the Microwave Journal, the ultra-broadband frequency conversion component was realized by using microwave multi-layer board design, which mainly uses 2.5D circuit design, and there are Poor electromagnetic compatibility, serious crosstalk, and low integration

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