Three-dimensional stacked structure of ltcc substrate and its hermetic packaging method
A three-dimensional stacking and airtight packaging technology, applied in electrical components, semiconductor/solid-state device parts, semiconductor devices, etc. The effect of repairability, simple process, scientific and reasonable design
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[0046] The present invention will be further described below with reference to the accompanying drawings and embodiments, and the mode of the present invention includes but not limited to the following embodiments.
[0047] Such as Figure 1-6 As shown, the three-dimensional stacked structure of LTCC substrates provided by the present invention has scientific and reasonable design, simple structure, and is convenient to use. Integration provides a simple, reliable solution. The three-dimensional stacked structure of LTCC substrates of the present invention includes a first LTCC substrate 1 on which components 17 are placed, and a second LTCC substrate 20 hermetically sealed on the top surface of the first LTCC substrate 1 .
[0048] The top surface of the first LTCC substrate 1 of the present invention is provided with a cavity for placing components 17, the top surface of the cavity is open, and the top surface of the first LTCC substrate 1 is arranged around the opening of ...
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