A LTCC substrate three-dimensional stacking structure and a
hermetic packaging method thereof are disclosed. The three-dimensional stacking structure comprises components, first and second LTCC substrates, first, second, third, fourth, fifth and sixth
metal film layer, and first and second pads. The
hermetic packaging method comprises the following steps of:
processing a substrate with a
ceramic dummy layer on a stacked
assembly surface by a conventional LTCC proces;
grinding and leveling the surface of the
assembly surface; fabricating metallized pads for solder
welding on the
assembly surface by a post-firing process; prefusing the solder in the
welding area and performing cleaning; assembling the components on the substrate; aligning the stacking assembling surfaces of the substrates with assembled components and performing heating to realize
sol bonding; cleaning the
weld seam and supplementing the solder; testing the airtightness of the stacked LTCC substrates, and
welding the substrates until the substrates are qualified if the airtightness is not up to the standard. The invention can realize the vertical
interconnection between the local hermetic
package of the substrate and the substrate including the high-frequency
signal, and provides a simple and reliable solution for the high-density integration.